Inventor

Feng Hou

Inventor
Shanghai, CN

Overview

5→
Patents
2018–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 5 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary
B29CShaping or joining of plastics19%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering19%
H04BTransmission13%
G03BApparatus or arrangements for taking photographs or for projecting or viewing them6%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices6%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light6%
H02JElectric power networks6%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems6%
H04JMultiplex communication6%
H04WWireless communication networks6%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2018–2021Patents assigned to PRISMLAB CHINA LTD (3)· patent assignee history
2018–2021Based in Shanghai, CN· patent location history
2020Patents assigned to SEMTECH CORP (1)· patent assignee history
2020Based in Coppell, TX, US· patent location history
2021Patents assigned to OPTIPULSE INC (1)· patent assignee history
2021Based in Albuquerque, NM, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
PRISMLAB CHINA LTD32018–2021
OPTIPULSE INC12021
SEMTECH CORP12020
Locations
LocationPatentsSpan
Shanghai, CN32018–2021
Albuquerque, NM, US12021
Coppell, Texas, US12020