LexDanaLexDanabeta
Inventor

Hiroshi Oishi

Inventor
Hamamatsu, JP

Overview

61→
Patents
1986–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 61 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
F02BInternal-combustion piston engines10%
B28DWorking stone or stone-like materials8%
H10DInorganic electric semiconductor devices6%
B24BMachines, devices, or processes for grinding or polishing4%
C30BSingle-crystal growth4%
H01LSemiconductor devices4%
B60RVehicles, vehicle fittings, or vehicle parts, not otherwise provided for3%
B63HMarine propulsion or steering3%
H01RElectrically-conductive connections3%
PatentTitleYear
10,559,679Nitride semiconductor epitaxial substrate202010,068,858Compound semiconductor substrate20189,748,344'Nitride semiconductor substrate having recesses at interface between base substrate and initial nitride'20179,536,955'Nitride semiconductor substrate'20179,530,846'Nitride semiconductor substrate'20169,117,743'Nitride semiconductor substrate'20159,086,321'Method of analyzing nitride semiconductor layer and method of manufacturing nitride semiconductor substrate using the analysis method'20158,986,243'Peritoneal dialysis patient connection system'20158,785,942'Nitride semiconductor substrate and method of manufacturing the same'20148,637,960'Nitride semiconductor substrate'20148,567,384'Slicing method and wire saw apparatus'20138,212,288'Compound semiconductor substrate comprising a multilayer buffer layer'20128,210,906'Slicing method and method for manufacturing epitaxial wafer'20128,167,681'Slicing method'20128,148,753'Compound semiconductor substrate having multiple buffer layers'20128,033,845'Rotary connector device'20117,997,262'Method of improving nanotopography of surface of wafer and wire saw apparatus'20117,988,530'Slicing method'20117,887,394'Double-disc grinding machine, static pressure pad, and double-disc grinding method using the same for semiconductor wafer'20117,811,108'Rotary connector device'20107,798,816'Rotary connector device'20107,758,362'Rotary connector'20107,699,050'Method of manufacturing (110) silicon wafer'20107,243,893'Dialysis solution bag stand'20076,764,326'Rotary connector having slip ring mechanism'20046,581,566'Air intake system of engine'20036,471,529'Rotary connector'20026,443,105'Radiator fan controller'20026,422,067'Slurry useful for wire-saw slicing and evaluation of slurry'20026,394,057'Arrangement of components for engine'20026,286,476'Engine lubricating system'20016,276,327'Engine layout for outboard motor'20016,261,166'Wire cleaning apparatus'20016,237,585'Wire-sawing machine'20016,234,160'Abnormality transmission system for wire saw'20016,178,961'Wire saw control method and wire saw'20016,082,343'Crankcase ventilation system'20006,076,495'Bearing arrangement for vertical engine'20006,065,461'Ingot slicing method and apparatus therefor'20006,062,209'Method of slicing a workpiece through use of a wire saw, and a wire saw'20006,004,405'Wafer having a laser mark on chamfered edge'19995,997,371'Choke control for outboard motor engine'19995,993,292'Production of notchless wafer'19995,981,392'Method of manufacturing semiconductor monocrystalline mirror-surface wafers which includes a gas phase etching process, and semiconductor monocrystalline mirror-surface wafers manufactured by the method'19995,978,203'Electronic part having communication means'19995,950,425'Exhaust manifold cooling'19995,913,488'Spiral cable reel'19995,876,256'Engine cooling system'19995,823,835'Outboard motor throttle control'19985,769,038'Liquid cooling system for engine'19985,328,395'Cowling structure for marine propulsion engine'19945,302,147'Cowling assembly for a marine propulsion engine'19945,263,884'Latch for a cowling of an outboard engine'19935,236,574'Electroplating of hot-galvanized steel sheet and continuous plating line therefor'19935,234,574'Process for direct zinc electroplating of aluminum strip'19935,069,981'Steel sheet dip-plated with a Zn-Al alloy and process for the manufacture thereof'19914,986,239'Ignition timing controller for internal combustion engine'19914,925,416'Clutch for marine propulsion'19904,832,641'Storage structure of liquid tank for marine propulsion'19894,767,004'Method of packing electronic parts and a pack produced by the method'19884,576,855'Coating composition and skinned polyurethane foam articles coated therewith'1986

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1989–2002Patents assigned to SANSHIN KOGYO KK (15)· patent assignee history
1989–2001Based in Hamamatsu, JP· patent location history
1999–2013Patents assigned to SHINETSU HANDOTAI KK (9)· patent assignee history
1999–2002Patents assigned to SUPER SILICON CRYSTAL RES INST (8)· patent assignee history
1999–2002Based in Annaka, JP· patent location history
1999–2015Based in Tokyo, JP· patent location history
2011–2013Based in Nishishirakawa, JP· patent location history
2012–2015Patents assigned to OISHI HIROSHI (7)· patent assignee history
2012–2015Patents assigned to COVALENT MATERIALS CORP (6)· patent assignee history
2012–2020Based in Hadano, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SANSHIN KOGYO KK151989–2002
SHINETSU HANDOTAI KK91999–2013
SUPER SILICON CRYSTAL RES INST81999–2002
OISHI HIROSHIself72012–2015
COVALENT MATERIALS CORP62012–2015
Locations
LocationPatentsSpan
Hamamatsu, JP151989–2001
Hadano, JP102012–2020
Annaka, JP101999–2002
Tokyo, JP91999–2015
Nishishirakawa, JP42011–2013