Inventor
Heinz O. Steimel
Inventor
Fishkill, NY, US
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H05KPrinted circuits25%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests25%
Y10TTechnical subjects covered by former us classification17%
PatentTitleYear
5,266,446'Method of making a multilayer thin film structure'19935,219,669'Layer thin film wiring process featuring self-alignment of vias'19935,196,251'Ceramic substrate having a protective coating thereon and a method for protecting a ceramic substrate'19935,130,229'Multi layer thin film wiring process featuring self-alignment of vias'1992Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1992–1993Patents assigned to IBM (4)· patent assignee history
1992–1993Based in Fishkill, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 4 | 1992–1993 |
Locations
| Location | Patents | Span |
|---|---|---|
| Fishkill, New York, US | 4 | 1992–1993 |