Inventor
Robert C. Hooper
Inventor
Houston, TX, US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
C25DProcesses for the electrolytic or electrophoretic production of coatings13%
H01GCapacitors13%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests13%
Y10TTechnical subjects covered by former us classification13%
PatentTitleYear
4,843,453'Metal contacts and interconnections for VLSI devices'19894,742,014'Method of making metal contacts and interconnections for VLSI devices with copper as a primary conductor'19884,619,887'Method of plating an interconnect metal onto a metal in VLSI devices'19864,182,781'Low cost method for forming elevated metal bumps on integrated circuit bodies employing an aluminum/palladium metallization base for electroless plating'19803,969,197'Method for fabricating a thin film capacitor'1976Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1976–1989Patents assigned to TEXAS INSTRUMENTS INC (5)· patent assignee history
1976Based in Plano, TX, US· patent location history
1980–1989Based in Houston, TX, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TEXAS INSTRUMENTS INC | 5 | 1976–1989 |
Locations
| Location | Patents | Span |
|---|---|---|
| Houston, Texas, US | 4 | 1980–1989 |
| Plano, Texas, US | 1 | 1976 |