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Inventor

Erwin Aguas Sangalang

Inventor
Singapore, SG

Overview

2→
Patents
2012–2013
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h10100%
PatentTitleYear
8,492,887'Integrated circuit packaging system with leadframe and method of manufacture thereof'20138,115,287'Integrated circuit packaging system with dual row lead-frame having top and bottom terminals and method of manufacture thereof'2012

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2012–2013Patents assigned to SANGALANG ERWIN AGUAS (2)· patent assignee history
2012–2013Patents assigned to STATS CHIPPAC LTD (2)· patent assignee history
2012Patents assigned to ADVINCULA ABELARDO JR HADAP (1)· patent assignee history
2012–2013Based in Singapore, SG· patent location history
2013Patents assigned to AGNO JAYBY (1)· patent assignee history
2013Patents assigned to ANONUEVO DEXTER (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SANGALANG ERWIN AGUASself22012–2013
STATS CHIPPAC LTD22012–2013
ADVINCULA ABELARDO JR HADAP12012
AGNO JAYBY12013
ANONUEVO DEXTER12013
Locations
LocationPatentsSpan
Singapore, SG22012–2013