Inventor
Shih-Ming Chen
Inventor
Hsinchu, TW
Overview
Patents· 48 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G02Bprimary
G02BOptical elements, systems or apparatus8%
H10DInorganic electric semiconductor devices8%
H02JElectric power networks7%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
Y10TTechnical subjects covered by former us classification6%
C08JWorking-up5%
C08LCompositions of macromolecular compounds5%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients3%
H01RElectrically-conductive connections3%
H05BElectric heating3%
PatentTitleYear
10,879,716Charging method, charging system and electronic device202010,879,715Method for improving temperature management of battery pack202010,751,970Three-dimensional structure202010,658,860Electronic device, charger within the electronic device, and detecting method for detecting abnormal status of connector of electronic device202010,554,058Systems and methods for monitoring an operating status of a connector202010,522,488Patterning polymer layer to reduce stress201910,498,054Jumper and power distribution device201910,285,422Composition consisting of brewer's spent grains and polylactic acid201910,266,718Protective material and protective structure and protective method201910,201,177Composition consisting of brewer's spent grains and polylactic acid and a method for making the same201910,148,101Battery charging system and battery charging protection control method201810,093,805Bio-plastic composite containing brewer's spent grains201810,097,177Switch device, control method of the same, and control method of transfer switch system using the same201810,063,022Powder distribution unit201810,030,148Bio-plastic composite containing brewer's spent grains and a method for making the same20189,778,712'Method of integrating a server using alternating current power into a server system using direct current power and alternative junction device therefor'20179,736,429'Cloud video system'20179,670,334'Shear thickening formulation and composite material employing the same'20179,219,012'Semiconductor device'20159,151,886'Optical thin film and edge-type backlight module containing the same'20158,581,386'Chip package'20138,374,000'Interleaved flyback converter device with leakage energy recycling'20138,287,947'Antireflective transparent zeolite hardcoat, method for fabricating the same'20128,268,227'Method for forming optical compensating films, optical compensating films formed thereby, structure of optical compensating films, and polarizing plates'20128,154,505'Backlight module having a chambered circuit board'20128,080,455'Method for fabricating semiconductor device with increased breakdown voltage'20118,067,283'Semiconductor device fabricating method'20118,063,439'Semiconductor device and fabrication method thereof'20117,965,441'Optical film with super low retardation and polarizing plate containing the same'20117,935,738'Transparent flexible film and fabrication method thereof'20117,884,471'Solder bump and related intermediate structure having primary and secondary portions and method of manufacturing same'20117,863,742'Back end integrated WLCSP structure without aluminum pads'20117,863,147'Semiconductor device and fabrication method thereof'20117,863,835'Flat panel display having backlight module'20117,854,522'Antiglare film and manufacturing method thereof'20107,576,551'Test socket and test board for wafer level semiconductor testing'20097,534,416'Antireflective transparent zeolite hardcoat, method for fabricating the same'20097,486,442'Polarizer protective film, polarizing plate, and visual display'20097,456,816'Lamp frequency control system for display and method for controlling lamp frequency'20087,381,461'Antireflective transparent zeolite hardcoat, method for fabricating the same'20087,364,998'Method for forming high reliability bump structure'20087,090,793'Preparation of fuel cell composite bipolar plate'20066,995,062'Method to improve flash forward tunneling voltage (FTV) performance'20066,977,213'IC chip solder bump structure and method of manufacturing same'20056,916,702'Gate process and gate structure for an embedded memory device'20056,825,085'Method to improve flash forward tunneling voltage (FTV) performance'20046,548,332'Thermal treatment process for forming thin film transistors without the use of plasma treatment to further improve the output property of the thin film transistor'20036,494,167'Solid and liquid separation device'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2011Patents assigned to TAIWAN SEMICONDUCTOR MFG (6)· patent assignee history
2004–2020Based in Hsinchu, TW· patent location history
2005–2015Patents assigned to VANGUARD INT SEMICONDUCT CORP (6)· patent assignee history
2005–2019Based in Miao-Li County, TW· patent location history
2005–2008Based in Miaoli, TW· patent location history
2008–2020Patents assigned to IND TECH RES INST (11)· patent assignee history
2008–2017Based in Tainan, TW· patent location history
2011–2015Patents assigned to CHEN SHIH-MING (9)· patent assignee history
2018–2020Patents assigned to MEDIATEK INC (5)· patent assignee history
2018–2019Based in Taipei, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IND TECH RES INST | 11 | 2008–2020 |
| CHEN SHIH-MINGself | 9 | 2011–2015 |
| TAIWAN SEMICONDUCTOR MFG | 6 | 2004–2011 |
| VANGUARD INT SEMICONDUCT CORP | 6 | 2005–2015 |
| MEDIATEK INC | 5 | 2018–2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 25 | 2004–2020 |
| Miao-Li County, TW | 6 | 2005–2019 |
| Tainan, TW | 6 | 2008–2017 |
| Taipei, TW | 3 | 2018–2019 |
| Miaoli, TW | 2 | 2005–2008 |