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Inventor

Tetsuyuki Tsuchida

Inventor
Tokyo, JP

Overview

2→
Patents
2017–2018
Patent span
Chemistry
Primary field (CPC C)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary
H05KPrinted circuits29%
B23KSoldering or unsoldering14%
C22CAlloys14%
C23CCoating metallic material14%
C25DProcesses for the electrolytic or electrophoretic production of coatings14%
H01LSemiconductor devices14%
PatentTitleYear
9,883,586'Wiring substrate for bonding using solder having a low melting point and method for manufacturing same'20189,572,252'Wiring substrate and method of manufacturing wiring substrate'2017

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2017–2018Patents assigned to TOPPAN PRINTING CO LTD (2)· patent assignee history
2017Patents assigned to NAT UNIV CORP GUNMA UNIV (1)· patent assignee history
2017–2018Based in Tokyo, JP· patent location history
2018Patents assigned to UNIV GUNMA NAT UNIV CORP (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TOPPAN PRINTING CO LTD22017–2018
NAT UNIV CORP GUNMA UNIV12017
UNIV GUNMA NAT UNIV CORP12018
Locations
LocationPatentsSpan
Tokyo, JP22017–2018