Inventor
Yasuo Arai
Inventor
Ibaraki, JP
Overview
Patents· 17 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices13%
H10DInorganic electric semiconductor devices13%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation10%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
C04BLime, magnesia4%
C08LCompositions of macromolecular compounds4%
C09JAdhesives4%
H03KPulse technique4%
Y02WClimate change mitigation technologies related to wastewater treatment or waste management4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
PatentTitleYear
10,622,263Semiconductor device having SOI substrate and first and second diffusion layer202010,418,985Radiation-damage-compensation-circuit and SOI-MOSFET20199,899,448'Semiconductor device having SOI substrate'20189,878,708'Control apparatus for vehicle, and vehicle'20189,318,391'Method for manufacturing semiconductor device including a MOS-type transistor'20168,963,246'Semiconductor device and method for manufacturing semiconductor device'20158,928,101'Semiconductor device'20155,502,418'Voltage-controlled oscillating circuit'19965,349,669'Data write control means'19945,347,412'Floating magnetic head'19944,950,701'Bonding method and adhesive useful for the method'19904,812,169'Process for producing a fire-resistant, light-weight construction material'19894,793,886'Bonding method and adhesive useful for the method'19884,748,444'LCD panel CMOS display circuit'19884,660,608'Method and apparatus for loading cosmetic material into a container and solidifying said cosmetic material'19874,586,958'Process for producing a fire-resistant, light-weight construction board'19864,066,810'Heat printing sheet and heat printing method'1978Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1986–1989Patents assigned to FUJI FIRE PROOF MATERIAL (2)· patent assignee history
1986–1989Based in Kunitachi, JP· patent location history
1987–1994Based in Tokyo, JP· patent location history
1996–2019Based in Tsukuba, JP· patent location history
2015–2020Patents assigned to LAPIS SEMICONDUCTOR CO LTD (5)· patent assignee history
2015Patents assigned to ARAI YASUO (2)· patent assignee history
2015Patents assigned to KASAI HIROKI (2)· patent assignee history
2015–2020Based in Ibaraki, JP· patent location history
2018–2020Patents assigned to INTER UNIV RESEARCH INSTITUTE CORPORATION HIGH ENERGY ACCELERATOR RESEARCH ORGANIZATION (3)· patent assignee history
2018Based in Anjo, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| LAPIS SEMICONDUCTOR CO LTD | 5 | 2015–2020 |
| INTER UNIV RESEARCH INSTITUTE CORPORATION HIGH ENERGY ACCELERATOR RESEARCH ORGANIZATION | 3 | 2018–2020 |
| ARAI YASUOself | 2 | 2015 |
| FUJI FIRE PROOF MATERIAL | 2 | 1986–1989 |
| KASAI HIROKI | 2 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ibaraki, JP | 5 | 2015–2020 |
| Tokyo, JP | 3 | 1987–1994 |
| Tsukuba, JP | 2 | 1996–2019 |
| Kunitachi, JP | 2 | 1986–1989 |
| Anjo, JP | 1 | 2018 |