Inventor
Xinglong Chen
Inventor
San Jose, CA, US
Overview
Patents· 43 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Jprimary
H01JElectric discharge tubes or discharge lamps23%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1023%
H01LSemiconductor devices18%
C23CCoating metallic material17%
Y10TTechnical subjects covered by former us classification4%
B05BSpraying apparatus2%
H10BElectronic memory devices2%
H10DInorganic electric semiconductor devices2%
H10NElectric solid-state devices not otherwise provided for2%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact1%
PatentTitleYear
10,604,863Lithium metaborate crystal, preparation method and use thereof202010,550,472Flow control features of CVD chambers202010,529,618Methods of manufacturing a semiconductor device202010,504,697Particle generation suppresor by DC bias modulation201910,424,485Enhanced etching processes using remote plasma sources201910,354,843Chemical control features in wafer process equipment201910,283,321Semiconductor processing system and methods using capacitively coupled plasma201910,256,079Semiconductor processing systems having multiple plasma configurations201910,170,282Insulated semiconductor faceplate designs201910,062,587Pedestal with multi-zone temperature control and multiple purge capabilities201810,056,233RPS assisted RF plasma source for semiconductor processing201810,032,606Semiconductor processing with DC assisted RF power for improved control20189,991,134Processing systems and methods for halide scavenging20189,978,564Chemical control features in wafer process equipment20189,892,888'Particle generation suppresor by DC bias modulation'20189,865,474'Etching method using plasma, and method of fabricating semiconductor device including the etching method'20189,768,051'Wafer clamping apparatus'20179,741,545'RPS assisted RF plasma source for semiconductor processing'20179,704,723'Processing systems and methods for halide scavenging'20179,659,792'Processing systems and methods for halide scavenging'20179,593,421'Particle generation suppressor by DC bias modulation'20179,524,889'Processing systems and apparatus adapted to process substrates in electronic device manufacturing'20169,520,301'Etching method using plasma, and method of fabricating semiconductor device including the etching method'20169,502,218'RPS assisted RF plasma source for semiconductor processing'20169,449,850'Processing systems and methods for halide scavenging'20169,384,997'Dry-etch selectivity'20169,373,517'Semiconductor processing with DC assisted RF power for improved control'20169,362,130'Enhanced etching processes using remote plasma sources'20169,267,739'Pedestal with multi-zone temperature control and multiple purge capabilities'20169,202,736'Method for refurbishing an electrostatic chuck with reduced plasma penetration and arcing'20159,184,055'Processing systems and methods for halide scavenging'20159,153,442'Processing systems and methods for halide scavenging'20159,144,147'Semiconductor processing system and methods using capacitively coupled plasma'20159,132,436'Chemical control features in wafer process equipment'20159,093,371'Processing systems and methods for halide scavenging'20159,023,732'Processing systems and methods for halide scavenging'20158,969,212'Dry-etch selectivity'20158,894,767'Flow control features of CVD chambers'20148,409,355'Low profile process kit'20138,108,981'Method of making an electrostatic chuck with reduced plasma penetration and arcing'20127,848,076'Method and apparatus for providing an electrostatic chuck with reduced plasma penetration and arcing'20107,789,993'Internal balanced coil for inductively coupled high density plasma processing chamber'20107,572,647'Internal balanced coil for inductively coupled high density plasma processing chamber'2009Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2009–2020Patents assigned to APPLIED MATERIALS INC (38)· patent assignee history
2009–2020Based in San Jose, CA, US· patent location history
2012–2019Patents assigned to CHEN XINGLONG (6)· patent assignee history
2012–2019Patents assigned to LUBOMIRSKY DMITRY (5)· patent assignee history
2012–2015Patents assigned to GONDHALEKAR SUDHIR (3)· patent assignee history
2016–2020Patents assigned to SAMSUNG ELECTRONICS CO LTD (4)· patent assignee history
2016–2020Based in Seongnam-si, KR· patent location history
2020Based in Urumqi, CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 38 | 2009–2020 |
| CHEN XINGLONGself | 6 | 2012–2019 |
| LUBOMIRSKY DMITRY | 5 | 2012–2019 |
| SAMSUNG ELECTRONICS CO LTD | 4 | 2016–2020 |
| GONDHALEKAR SUDHIR | 3 | 2012–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| San Jose, California, US | 38 | 2009–2020 |
| Seongnam-si, KR | 4 | 2016–2020 |
| Urumqi, CN | 1 | 2020 |