Inventor
SUNG YUN LEE
Inventor
KR
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices20%
H10BElectronic memory devices20%
H10DInorganic electric semiconductor devices20%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
B21DWorking or processing of sheet metal or metal tubes, rods or profiles without essentially removing material7%
C21DModifying the physical structure of ferrous metals7%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
PatentTitleYear
12,186,792Hot-stamping molding method enabling molding of components having various levels of strength by part through cooling control by position202511,910,614Three dimensional semiconductor device and method of forming the same202411,411,024Vertical type semiconductor devices and methods of manufacturing the same202211,296,104Three dimensional semiconductor device and method of forming the same2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to SAMSUNG ELECTRONICS CO LTD (3)· patent assignee history
2022–2025Based in KR· patent location history
2025Patents assigned to KOREA INST IND TECH (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 3 | 2022–2024 |
| KOREA INST IND TECH | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 4 | 2022–2025 |