Inventor

James William RING

Inventor

Overview

2→

Patents

2022

Patent span

Performing operations

Primary field (CPC B)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary

B29CShaping or joining of plastics14%

B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering14%

B41JTypewriters14%

G01FMeasuring volume, volume flow, mass flow or liquid level14%

G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure14%

G06FElectric digital data processing14%

H03KPulse technique14%

PatentTitleYear

11,351,791Logic circuitry package2022 11,338,586Logic circuitry2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022Patents assigned to HEWLETT PACKARD DEVELOPMENT CO (2)· patent assignee history

2022Based in US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
HEWLETT PACKARD DEVELOPMENT CO	2	2022

Locations

Location	Patents	Span
US	2	2022