LexDanaLexDanabeta
Inventor

Jerry A. Gorrell

Inventor
Lagrangeville, NY, US

Overview

3→
Patents
2005–2010
Patent span
Performing operations
Primary field (CPC B)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary
B23KSoldering or unsoldering14%
B30BPresses in general14%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form14%
H05KPrinted circuits14%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%
Y10TTechnical subjects covered by former us classification14%
PatentTitleYear
7,833,897'Process for making interconnect solder Pb-free bumps free from organo-tin/tin deposits on the wafer surface'20107,666,780'Alignment verification for C4NP solder transfer'20106,892,781'Method and apparatus for application of pressure to a workpiece by thermal expansion'2005

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2005–2010Patents assigned to IBM (3)· patent assignee history
2005–2010Based in Lagrangeville, NY, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
IBM32005–2010
Locations
LocationPatentsSpan
Lagrangeville, New York, US32005–2010