Inventor

Yat Kit Tsui

Inventor

Hong Kong, CN

Overview

5→

Patents

2012–2017

Patent span

Electricity

Primary field (CPC H)

Patents· 5 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%

H01LSemiconductor devices25%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation17%

F28FDetails of heat-exchange and heat-transfer apparatus, of general application8%

H05KPrinted circuits8%

H10DInorganic electric semiconductor devices8%

PatentTitleYear

9,713,284'Locally enhanced direct liquid cooling system for high power applications'2017 9,117,715'Wafer-level device packaging'2015 8,823,126'Low cost backside illuminated CMOS image sensor package with high integration'2014 8,754,507'Forming through-silicon-vias for multi-wafer integrated circuits'2014 8,232,626'Via and method of via forming and method of via filling'2012

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2012–2015Patents assigned to HK APPLIED SCIENCE & TECH RES (4)· patent assignee history

2012–2015Patents assigned to TSUI YAT KIT (4)· patent assignee history

2012–2015Patents assigned to YANG DAN (3)· patent assignee history

2012Based in Tuen Mun, HK· patent location history

2014–2015Patents assigned to LAW PUI CHUNG (2)· patent assignee history

2014–2017Based in Hong Kong, CN· patent location history

2017Patents assigned to HONG KONG APPLIED SCIENCE AND TECH RES INST CO LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
HK APPLIED SCIENCE & TECH RES	4	2012–2015
TSUI YAT KITself	4	2012–2015
YANG DAN	3	2012–2015
LAW PUI CHUNG	2	2014–2015
HONG KONG APPLIED SCIENCE AND TECH RES INST CO LTD	1	2017

Locations

Location	Patents	Span
Hong Kong, CN	4	2014–2017
Tuen Mun, HK	1	2012