Inventor
YONGMOO SHIN
Inventor
KR
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices45%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1045%
H05KPrinted circuits9%
PatentTitleYear
12,588,572Semiconductor device and method of forming fine pitch conductive posts with graphene-coated cores202612,581,974Semiconductor device and method of making a semiconductor package with graphene-coated interconnects202612,564,059Semiconductor device and method of forming graphene core shell embedded within shielding layer202612,431,422Semiconductor device and method of forming RDL with graphene-coated core202512,400,929Semiconductor device and method of forming graphene-coated core embedded within TIM2025Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2025–2026Patents assigned to STATS CHIPPAC PTE LTD (5)· patent assignee history
2025–2026Based in KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| STATS CHIPPAC PTE LTD | 5 | 2025–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 5 | 2025–2026 |