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Inventor

Ruedi Grueter

Inventor
Buttisholz, CH

Overview

6→
Patents
2003–2017
Patent span
Electricity
Primary field (CPC H)

Patents· 6 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1024%
H05KPrinted circuits14%
Y10TTechnical subjects covered by former us classification14%
H01LSemiconductor devices10%
B05CApparatus for applying fluent materials to surfaces, in general5%
B23KSoldering or unsoldering5%
PatentTitleYear
9,603,294'Apparatus for mounting semiconductor chips'20179,233,389'Device for dispensing adhesive on a substrate'20168,166,637'Apparatus for mounting a flip chip on a substrate'20127,597,234'Method for mounting a flip chip on a substrate'20097,020,954'Apparatus for placing a semiconductor chip as a flipchip on a substrate'20066,585,145'Die bonder and/or wire bonder with a device for holding down a substrate'2003

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2003–2006Patents assigned to ESEC TRADING SA (2)· patent assignee history
2003–2006Based in Neuenkirch, CH· patent location history
2009–2017Based in Buttisholz, CH· patent location history
2012–2017Patents assigned to ESEC AG (2)· patent assignee history
2012–2017Patents assigned to GRUETER RUEDI (2)· patent assignee history
2012Patents assigned to BLESSING PATRICK (1)· patent assignee history
2016Patents assigned to BESI SWITZERLAND AG (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ESEC AG22012–2017
ESEC TRADING SA22003–2006
GRUETER RUEDIself22012–2017
BESI SWITZERLAND AG12016
BLESSING PATRICK12012
Locations
LocationPatentsSpan
Buttisholz, CH42009–2017
Neuenkirch, CH22003–2006