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Inventor

Hideo Ohsawa

Inventor
Tokyo, JP

Overview

1→
Patents
2020
Patent span
Chemistry
Primary field (CPC C)

Patents· 1 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B05Dprimary
B05DProcesses for applying fluent materials to surfaces, in general17%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients17%
C08LCompositions of macromolecular compounds17%
C23CCoating metallic material17%
H01BCables17%
Y10TTechnical subjects covered by former us classification17%
PatentTitleYear
10,559,407Process for producing electrical wire molded body2020

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2020Patents assigned to KISHIMOTO SHINICHI (1)· patent assignee history
2020Patents assigned to OHSAWA Hideo (1)· patent assignee history
2020Patents assigned to RIKEN TECHNOS CORP (1)· patent assignee history
2020Patents assigned to SAITO SHINICHI (1)· patent assignee history
2020Based in Tokyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
KISHIMOTO SHINICHI12020
OHSAWA Hideoself12020
RIKEN TECHNOS CORP12020
SAITO SHINICHI12020
Locations
LocationPatentsSpan
Tokyo, JP12020