Inventor
KUO-HWA TZENG
Inventor
TW
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices30%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
H10DInorganic electric semiconductor devices13%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation9%
PatentTitleYear
12,237,165Method for wafer bonding including edge trimming202512,211,877Back-side deep trench isolation structure for image sensor202512,027,469Electronic device package and method of manufacturing the same202411,955,496Back-side deep trench isolation structure for image sensor202411,855,159Method for forming thin semiconductor-on-insulator (SOI) substrates202311,264,469Method for forming thin semiconductor-on-insulator (SOI) substrates202211,164,945SOI substrate, semiconductor device and method for manufacturing the same2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (6)· patent assignee history
2021–2025Based in TW· patent location history
2024Patents assigned to ADVANCED SEMICONDUCTOR ENG (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 6 | 2021–2025 |
| ADVANCED SEMICONDUCTOR ENG | 1 | 2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 7 | 2021–2025 |