Inventor

Robert A. Groves

Inventor

Highland, NY, US

Overview

2001–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 58 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Dprimary

H10DInorganic electric semiconductor devices17%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%

H01FMagnets15%

H01HElectric switches8%

B81BMicrostructural devices or systems, e.g. micromechanical devices5%

G06FElectric digital data processing4%

H01LSemiconductor devices4%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%

Y10TTechnical subjects covered by former us classification3%

B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems2%

PatentTitleYear

10,734,475Stacked MIM capacitors with self-aligned contact to reduce via enclosure2020 10,714,420High cutoff frequency metal-insulator-metal capacitors implemented using via contact configurations2020 10,643,790Manufacturing method for 3D multipath inductor2020 10,393,782Structures and methods for RF de-embedding2019 10,049,806High efficiency on-chip 3D transformer structure2018 9,865,392'Solenoidal series stacked multipath inductor'2018 9,779,869'High efficiency on-chip 3D transformer structure'2017 9,612,612'Tunable sector buffer for wide bandwidth resonant global clock distribution'2017 9,570,233'High-Q multipath parallel stacked inductor'2017 9,548,158'3D multipath inductor'2017 9,318,620'Folded conical inductor'2016 9,171,663'High efficiency on-chip 3D transformer structure'2015 9,105,381'High frequency inductor structure having increased inductance density and quality factor'2015 9,058,130'Tunable sector buffer for wide bandwidth resonant global clock distribution'2015 9,054,682'Wide bandwidth resonant global clock distribution'2015 8,917,083'Structures and methods for RF de-embedding'2014 8,836,460'Folded conical inductor'2014 8,754,736'Inductor structure having increased inductance density and quality factor'2014 8,704,576'Variable resistance switch for wide bandwidth resonant global clock distribution'2014 8,645,898'Structure and design structure for high-Q value inductor and method of manufacturing the same'2014 8,640,077'Capturing mutual coupling effects between an integrated circuit chip and chip package'2014 8,232,173'Structure and design structure for high-Q value inductor and method of manufacturing the same'2012 7,851,923'Low resistance and inductance backside through vias and methods of fabricating same'2010 7,739,636'Design structure incorporating semiconductor device structures that shield a bond pad from electrical noise'2010 7,608,909'Suspended transmission line structures in back end of line processing'2009 7,602,265'Apparatus for accurate and efficient quality and reliability evaluation of micro electromechanical systems'2009 7,563,714'Low resistance and inductance backside through vias and methods of fabricating same'2009 7,463,112'Area efficient, differential T-coil impedance-matching circuit for high speed communications applications'2008 7,273,806'Forming of high aspect ratio conductive structure using injection molded solder'2007 7,212,091'Micro-electro-mechanical RF switch'2007 7,129,561'Tri-metal and dual-metal stacked inductors'2006 7,053,460'Multi-level RF passive device'2006 7,045,372'Apparatus and method for forming a battery in an integrated circuit'2006 7,005,371'Method of forming suspended transmission line structures in back end of line processing'2006 6,936,764'Three dimensional dynamically shielded high-Q BEOL metallization'2005 6,876,282'Micro-electro-mechanical RF switch'2005 6,836,029'Micro-electromechanical switch having a conductive compressible electrode'2004 6,833,603'Dynamically patterned shielded high-Q inductor'2004 6,831,542'Micro-electromechanical inductive switch'2004 6,798,029'Method of fabricating micro-electromechanical switches on CMOS compatible substrates'2004 6,762,479'Microwave array transistor for low-noise and high-power applications'2004 6,762,088'High Q inductor with faraday shield and dielectric well buried in substrate'2004 6,720,230'Method of fabricating integrated coil inductors for IC devices'2004 6,714,113'Inductor for integrated circuits'2004 6,701,779'Perpendicular torsion micro-electromechanical switch'2004 6,696,343'Micro-electromechanical varactor with enhanced tuning range'2004 6,661,069'Micro-electromechanical varactor with enhanced tuning range'2003 6,650,000'Apparatus and method for forming a battery in an integrated circuit'2003 6,639,488'MEMS RF switch with low actuation voltage'2003 6,635,506'Method of fabricating micro-electromechanical switches on CMOS compatible substrates'2003 6,549,096'Switched inductor/varactor tuning circuit having a variable integrated inductor'2003 6,534,843'High Q inductor with faraday shield and dielectric well buried in substrate'2003 6,492,708'Integrated coil inductors for IC devices'2002 6,489,663'Spiral inductor semiconducting device with grounding strips and conducting vias'2002 6,489,857'Multiposition micro electromechanical switch'2002 6,423,603'Method of forming a microwave array transistor for low-noise and high-power applications'2002 6,414,371'Process and structure for 50 gigahertz transistor'2002 6,303,975'Low noise, high frequency solid state diode'2001

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2001–2020Patents assigned to IBM (54)· patent assignee history

2001–2004Based in Poughkeepsie, NY, US· patent location history

2002–2020Based in Highland, NY, US· patent location history

2012–2014Patents assigned to GROVES ROBERT A (5)· patent assignee history

2012–2014Patents assigned to DING HANYI (2)· patent assignee history

2012–2014Patents assigned to ERTURK METE (2)· patent assignee history

2017–2020Patents assigned to GLOBALFOUNDRIES INC (4)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
IBM	54	2001–2020
GROVES ROBERT Aself	5	2012–2014
GLOBALFOUNDRIES INC	4	2017–2020
DING HANYI	2	2012–2014
ERTURK METE	2	2012–2014

Locations

Location	Patents	Span
Highland, New York, US	55	2002–2020
Poughkeepsie, New York, US	3	2001–2004