Inventor
Chih-Hang Tung
Inventor
Hsinchu, TW
Overview
Patents· 46 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1035%
H01LSemiconductor devices32%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
B23KSoldering or unsoldering6%
H05KPrinted circuits6%
H10DInorganic electric semiconductor devices5%
Y10TTechnical subjects covered by former us classification2%
B29CShaping or joining of plastics2%
C22CAlloys2%
H01QAntennas, i.e. radio aerials2%
PatentTitleYear
10,854,580Semiconductor structure along with multiple chips bonded through microbump and manufacturing method thereof202010,734,279Semiconductor package device with integrated antenna and manufacturing method thereof202010,734,348Bonded semiconductor devices and methods of forming the same202010,714,457Semiconductor packages and methods of forming same202010,522,491Semiconductor device and bump formation process201910,468,385Semiconductor structure including plurality of chips along with air gap and manufacturing method thereof201910,460,987Semiconductor package device with integrated antenna and manufacturing method thereof201910,319,690Semiconductor structure and manufacturing method thereof201910,290,611Semiconductor packages and methods of forming same201910,229,901Immersion interconnections for semiconductor devices and methods of manufacture thereof201910,163,835Solder bump stretching method201810,153,218Semiconductor structure and manufacturing method thereof201810,141,291Semiconductor device and method of manufacturing the same201810,068,868Multi-strike process for bonding packages and the packages thereof201810,034,390Metal post bonding using pre-fabricated metal posts20189,997,467Semiconductor packages and methods of forming the same20189,978,709Solder bump stretching method for forming a solder bump joint in a device20189,960,134Semiconductor device and bump formation process20189,893,046'Thinning process using metal-assisted chemical etching'20189,881,888'Manufacturing method of interconnect structure'20189,842,817'Solder bump stretching method and device for performing the same'20179,735,276'Non-planar transistors and methods of fabrication thereof'20179,679,882'Method of multi-chip wafer level packaging'20179,576,929'Multi-strike process for bonding'20179,564,420'Functional block stacked 3DIC and method of making same'20179,530,715'Thermally enhanced structure for multi-chip device'20169,521,795'Two-step direct bonding processes and tools for performing the same'20169,475,145'Solder bump joint in a device including lamellar structures'20169,472,524'Copper-containing layer on under-bump metallization layer'20169,455,183'Semiconductor device and bump formation process'20169,343,436'Stacked package and method of manufacturing the same'20169,331,038'Semiconductor interconnect structure'20169,293,437'Functional block stacked 3DIC and method of making same'20169,263,407'Method for manufacturing a plurality of metal posts'20169,216,469'Indirect printing bumping method for solder ball deposition'20159,159,686'Crack stopper on under-bump metallization layer'20159,136,143'Thermally enhanced structure for multi-chip device'20159,082,763'Joint structure for substrates and methods of forming'20159,054,194'Non-planar transistors and methods of fabrication thereof'20158,927,877'Looped interconnect structure'20158,803,333'Three-dimensional chip stack and method of forming the same'20148,754,514'Multi-chip wafer level package'20148,685,798'Methods for forming through vias'20148,531,032'Thermally enhanced structure for multi-chip device'20138,476,770'Apparatus and methods for forming through vias'20138,308,052'Thermal gradient reflow for forming columnar grain structures for solder bumps'2012Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2012–2016Patents assigned to TAIWAN SEMICONDUCTOR MFG (14)· patent assignee history
2012–2015Patents assigned to TUNG CHIH-HANG (9)· patent assignee history
2012Based in Singapore, SG· patent location history
2013–2015Patents assigned to SHIH DA-YUAN (5)· patent assignee history
2013–2015Patents assigned to YU CHEN-HUA (5)· patent assignee history
2013–2020Based in Hsinchu, TW· patent location history
2015–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (31)· patent assignee history
2018Based in Jhubei City, TW· patent location history
2019–2020Based in Hsinchu County, TW· patent location history
2020Based in Chu Pei, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 31 | 2015–2020 |
| TAIWAN SEMICONDUCTOR MFG | 14 | 2012–2016 |
| TUNG CHIH-HANGself | 9 | 2012–2015 |
| SHIH DA-YUAN | 5 | 2013–2015 |
| YU CHEN-HUA | 5 | 2013–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 39 | 2013–2020 |
| Hsinchu County, TW | 4 | 2019–2020 |
| Chu Pei, TW | 1 | 2020 |
| Jhubei City, TW | 1 | 2018 |
| Singapore, SG | 1 | 2012 |