Inventor
William Tang
Inventor
Orinda, CA, US
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H03Hprimary
H03HImpedance networks, e.g. resonant circuits20%
H03MCoding20%
H01LSemiconductor devices10%
H02HEmergency protective circuit arrangements10%
H02JElectric power networks10%
H10DInorganic electric semiconductor devices10%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%
PatentTitleYear
10,991,586In-situ tungsten deposition without barrier layer20217,233,472'Highly efficient line transient protection circuit for high power loads'20076,882,136'Variable impedance network for an integrated circuit potentiometer'20056,788,042'Variable impedance network for an integrated circuit potentiometer'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2005Patents assigned to WINBOND ELECTRONICS CORP (2)· patent assignee history
2004–2005Based in Orinda, CA, US· patent location history
2007Patents assigned to NORTHROP GRUMMAN CORP (1)· patent assignee history
2007Based in Bolingbrook, IL, US· patent location history
2021Patents assigned to APPLIED MATERIALS INC (1)· patent assignee history
2021Based in Santa Clara, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| WINBOND ELECTRONICS CORP | 2 | 2004–2005 |
| APPLIED MATERIALS INC | 1 | 2021 |
| NORTHROP GRUMMAN CORP | 1 | 2007 |
Locations
| Location | Patents | Span |
|---|---|---|
| Orinda, California, US | 2 | 2004–2005 |
| Santa Clara, California, US | 1 | 2021 |
| Bolingbrook, Illinois, US | 1 | 2007 |