Inventor

Yun-wei CHENG

Inventor

Overview

92→

Patents

2021–2026

Patent span

Electricity

Primary field (CPC H)

Patents· 92 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Fprimary

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation37%

H01LSemiconductor devices32%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%

H04NPictorial communication, e.g. television8%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%

H10DInorganic electric semiconductor devices3%

G02BOptical elements, systems or apparatus2%

G01RMeasuring electric variables1%

Y02PClimate change mitigation technologies in the production or processing of goods1%

G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light1%

PatentTitleYear

12,598,831Pixel shielding using air gaps2026 12,593,147Structures and methods for phase detection auto focus2026 12,575,198Vertically arranged semiconductor pixel sensor2026 12,470,847Image sensor device and methods of formation2025 12,469,752Mid-manufacturing semiconductor wafer layer testing2025 12,471,408Semiconductor structure and method of manufacturing the same2025 12,457,812Semiconductor structure and method of manufacturing the same2025 12,446,338Method for manufacturing image sensor including forming FinFET transfer gate having a plurality of channel fins above a p-type region2025 12,408,464Semiconductor arrangement with isolation structure2025 12,407,809Pixel array including dark pixel sensors2025 12,400,928Heat dissipation structures2025 12,402,422Near infrared light sensor with improved light coupling and CMOS image sensor including same2025 12,396,285Integration of solar cell and image sensor2025 12,386,073Pixel array including time-of-flight sensors2025 12,382,734Back side illuminated image sensor device with select dielectric layers on the backside and methods of forming the same2025 12,376,403Low-refractivity grid structure and method forming same2025 12,364,043Image sensor device2025 12,356,749Image sensor device2025 12,342,647Semiconductor arrangement and method of making2025 12,324,254Back side illuminated image sensor device with select dielectric layers on the backside and methods of forming the same2025 12,324,258Image sensor with improved quantum efficiency surface structure2025 12,300,664Edge-trimming methods for wafer bonding and dicing2025 12,277,795Optical fingerprint sensor with enhanced anti-counterfeiting features2025 12,243,894Stacked image sensors and methods of formation2025 12,243,898Image sensor with high quantum efficiency2025 12,243,893Image sensor device2025 12,224,297Method of forming an image sensor having stress releasing structure2025 12,218,051Method of manufacturing a semiconductor device including a plurality of circuit components and array of conductive contacts2025 12,211,869Optical blocking structures for black level correction pixels in an image sensor2025 12,211,862Multi-protrusion transfer gate manufacturing method2025 12,191,334Semiconductor device with buffer layer and method of forming2025 12,176,361Electromagnetic radiation detection method2024 12,170,302Increased optical path for long wavelength light by grating structure2024 12,166,048Pixel array including octagon pixel sensors2024 12,164,034Pixel array including time-of-flight sensors2024 12,154,933Image sensors with stress adjusting layers2024 12,142,630Vertically arranged semiconductor pixel sensor2024 12,113,086Apparatus and methods for sensing long wavelength light2024 12,088,940Semiconductor device and method of manufacture2024 12,081,866Image sensor including light shielding layer and patterned dielectric layer2024 12,068,246Redistribution layer layouts on integrated circuits and methods for manufacturing the same2024 12,051,704Pixel array including octagon pixel sensors2024 12,046,528Heat dissipation structures2024 12,033,902Mid-manufacturing semiconductor wafer layer testing2024 12,021,054Redistribution layer (RDL) layouts for integrated circuits2024 12,021,105Pixel array including octagon pixel sensors2024 11,996,428Optical blocking structures for black level correction pixels in an image sensor2024 11,985,438Pixel array including dark pixel sensors2024 11,956,553Image sensor for sensing LED light with reduced flickering2024 11,843,013Polarizers for image sensor devices2023 11,837,614Fast charge transfer floating diffusion region for a photodetector and methods of forming the same2023 11,837,619Semiconductor arrangement with isolation structure2023 11,824,073Image sensor device2023 11,810,933Image sensor device and fabrication method thereof2023 11,810,936Pixel array including air gap reflection structures2023 11,798,969Apparatus and methods for sensing long wavelength light2023 11,791,299Redistribution layer (RDL) layouts for integrated circuits2023 11,791,358Method of forming semiconductor device2023 11,769,780Image sensors with stress adjusting layers2023 11,736,831Semiconductor device and method of manufacture2023 11,735,619Semiconductor image sensor device having back side illuminated image sensors with embedded color filters2023 11,735,618Stacked grid design for improved optical performance and isolation2023 11,728,364Low-refractivity grid structure and method forming same2023 11,728,365Semiconductor device with a radiation sensing region and method for forming the same2023 11,706,525Image sensor including light shielding layer and patterned dielectric layer2023 11,670,651Pixel array including octagon pixel sensors2023 11,670,562Heat dissipation structures2023 11,652,124Isolation structure having an air gap to reduce pixel crosstalk2023 11,626,435Image sensor2023 11,581,352Increased optical path for long wavelength light by grating structure2023 11,569,289Image sensor having stress releasing structure and method of forming same2023 11,569,288Image sensor having stress releasing structure and method of forming same2023 11,527,563Photodetector using a buried gate electrode for a transfer transistor and methods of manufacturing the same2022 11,521,997Multi-protrusion transfer gate structure2022 11,495,632Back side illuminated image sensor with deep trench isolation structures and self-aligned color filters2022 11,482,506Edge-trimming methods for wafer bonding and dicing2022 11,367,745Apparatus and methods for sensing long wavelength light2022 11,355,545Semiconductor image sensor device having back side illuminated image sensors with embedded color filters2022 11,302,738Image sensor with improved quantum efficiency surface structure2022 11,302,730Polarizers for image sensor devices2022 11,258,971Multi-function transfer gate electrode for a photodetector and methods of operating the same2022 11,233,082Formation method of light sensing device2022 11,227,886Mechanisms for forming image sensor device2022 11,195,867High dielectric constant dielectric layer forming method, image sensor device, and manufacturing method thereof2021 11,189,653Semiconductor device with buffer layer and method of forming2021 11,189,657Image sensor with improved quantum efficiency surface structure2021 11,177,306Support structure for integrated circuitry2021 11,177,309Image sensor with pad structure2021 11,177,304Method for forming light-sensing device2021 11,177,305Method for fabricating image sensor2021 11,164,902Image sensor having isolation structure2021 11,140,309Image sensor including light shielding layer and patterned dielectric layer2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (91)· patent assignee history

2021–2026Based in TW· patent location history

2026Patents assigned to TAIWAN SEMICONDUCTOR MFG COMPANY LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	91	2021–2026
TAIWAN SEMICONDUCTOR MFG COMPANY LTD	1	2026

Locations

Location	Patents	Span
TW	92	2021–2026