Inventor
David Chazan
Inventor
Palo Alto, CA, US
Overview
Patents· 26 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G01Nprimary
G01NInvestigating or analysing materials by determining their chemical or physical properties11%
H05KPrinted circuits10%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%
Y10TTechnical subjects covered by former us classification9%
A61BDiagnosis4%
B01LChemical or physical laboratory apparatus for general use4%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers4%
H05BElectric heating4%
A61FFilters implantable into blood vessels3%
A61LMethods or apparatus for sterilising materials or objects in general3%
PatentTitleYear
10,980,629Fluid for accommodating intraocular lenses202110,609,492Anatomically customized ear canal hearing apparatus202010,284,964Anatomically customized ear canal hearing apparatus20199,392,377'Anatomically customized ear canal hearing apparatus'20168,900,298'Fluid for accommodating intraocular lenses'20148,206,311'Analyzer for nitric oxide in exhaled breath with multiple-use sensor'20128,181,503'Disposable sensor for use in measuring an analyte in gaseous sample'20127,611,671'Reduction of carbon monoxide interference in gaseous analyte detectors'20097,533,558'Disposable sensor for use in measuring an analyte in a gaseous sample'20097,351,377'Methods and devices for enhancing bonded substrate yields and regulating temperature'20087,278,291'Trace gas sensor with reduced degradation'20077,220,387'Disposable sensor for use in measuring an analyte in a gaseous sample'20077,069,952'Microfluidic devices and methods of their manufacture'20066,756,019'Microfluidic devices and systems incorporating cover layers'20046,752,966'Microfabrication methods and devices'20046,635,487'Fluorescence standard for use in microfluidic instruments'20036,509,529'Isolated flip chip of BGA to minimize interconnect stress due to thermal mismatch'20036,323,435'Low-impedance high-density deposited-on-laminate structures having reduced stress'20016,317,331'Wiring substrate with thermal insert'20016,299,053'Isolated flip chip or BGA to minimize interconnect stress due to thermal mismatch'20016,262,579'Method and structure for detecting open vias in high density interconnect substrates'20016,165,892'Method of planarizing thin film layers deposited over a common circuit base'20005,214,000'Thermal transfer posts for high density multichip substrates and formation method'19934,801,785'Electrical devices'19894,548,662'Method of providing a protective covering over a substrate'19854,517,449'Laminar electrical heaters'1985Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1985–1993Patents assigned to RAYCHEM CORP (4)· patent assignee history
1985–2021Based in Palo Alto, CA, US· patent location history
2000–2003Patents assigned to KULICKE & SOFFA HOLDINGS INC (6)· patent assignee history
2004–2008Patents assigned to CALIPER LIFE SCIENCES INC (3)· patent assignee history
2007–2009Patents assigned to APIERON BIOSYSTEMS CORP (3)· patent assignee history
2016–2020Patents assigned to EARLENS CORP (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| KULICKE & SOFFA HOLDINGS INC | 6 | 2000–2003 |
| RAYCHEM CORP | 4 | 1985–1993 |
| APIERON BIOSYSTEMS CORP | 3 | 2007–2009 |
| CALIPER LIFE SCIENCES INC | 3 | 2004–2008 |
| EARLENS CORP | 3 | 2016–2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Palo Alto, California, US | 26 | 1985–2021 |