Inventor

Michael T. Peets

Inventor

Staatsburg, NY, US

Overview

1998–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 48 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary

H05KPrinted circuits38%

G06FElectric digital data processing14%

H01RElectrically-conductive connections11%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%

Y10TTechnical subjects covered by former us classification9%

G01DMeasuring not specially adapted for a specific variable4%

G08BSignalling systems, e.g. personal calling systems4%

B60LPropulsion of electrically-propelled vehicles1%

F16BDevices for fastening or securing constructional elements or machine parts together, e.g. nails, bolts, circlips, clamps, clips or wedges1%

G06TImage data processing or generation, in general1%

PatentTitleYear

10,973,157Printed circuit card assembly connectable to a server chassis2021 10,930,411Hybrid cable assembly having shielded and unshielded portions2021 10,903,534Battery pack capacity optimization via self-regulation of cell temperature2021 10,685,146Overlapping, discrete tamper-respondent sensors2020 10,561,047Electromagnetic gaskets for a cable connection2020 10,412,864Electromagnetic gaskets for a cable connection2019 10,395,067Method of fabricating a tamper-respondent sensor assembly2019 10,378,924Circuit boards and electronic packages with embedded tamper-respondent sensor2019 10,378,925Circuit boards and electronic packages with embedded tamper-respondent sensor2019 10,331,915Overlapping, discrete tamper-respondent sensors2019 10,271,434Method of fabricating a tamper-respondent assembly with region(s) of increased susceptibility to damage2019 10,251,288Tamper-respondent assembly with vent structure2019 10,237,964Manufacturing electronic package with heat transfer element(s)2019 10,178,818Enclosure with inner tamper-respondent sensor(s) and physical security element(s)2019 10,175,064Circuit boards and electronic packages with embedded tamper-respondent sensor2019 10,172,232Tamper-respondent assemblies with enclosure-to-board protection2019 10,168,185Circuit boards and electronic packages with embedded tamper-respondent sensor2019 10,098,235Tamper-respondent assemblies with region(s) of increased susceptibility to damage2018 10,028,419Electromagnetic gaskets for a cable connection2018 10,019,028Latch and spring assembly2018 9,949,399Positive pressure-applying latch mechanism2018 9,943,004Positive pressure-applying latch mechanism2018 9,911,012'Overlapping, discrete tamper-respondent sensors'2018 9,913,416'Enclosure with inner tamper-respondent sensor(s) and physical security element(s)'2018 9,913,389'Tamper-respondent assembly with vent structure'2018 9,877,383Tamper-respondent assemblies with enclosure-to-board protection2018 9,717,154'Enclosure with inner tamper-respondent sensor(s)'2017 9,661,747'Tamper-respondent assemblies with enclosure-to-board protection'2017 9,615,492'Electromagnetic gaskets for a cable connection'2017 9,591,776'Enclosure with inner tamper-respondent sensor(s)'2017 9,585,284'Fabrication of positive pressure-applying latch mechanism'2017 9,578,764'Enclosure with inner tamper-respondent sensor(s) and physical security element(s)'2017 9,560,737'Electronic package with heat transfer element(s)'2017 9,554,477'Tamper-respondent assemblies with enclosure-to-board protection'2017 9,547,334'Latch and spring assembly'2017 9,433,119'Positive pressure-applying latch mechanism'2016 9,325,086'Doubling available printed wiring card edge for high speed interconnect in electronic packaging applications'2016 8,953,332'Positive pressure-applying compliant latch mechanism'2015 8,936,497'Connector with a rotatably coupled cam shaft having a connect-assist element'2015 7,883,368'Hook end folding electromagnetic compatibilty gasket'2011 7,791,902'Method and a system having a flexible gasket and a gliding connector aligner'2010 7,683,267'Collapsible EMC gasket'2010 7,646,600'Structural support module to prevent common interface deflection'2010 7,540,757'Fail-safe lockout for blind mate card'2009 7,505,251'Actuation mechanism for mating electronic card interconnect systems'2009 7,491,900'EMC gasket filler and method'2009 6,863,562'Pin mounted circuit board retainer'2005 5,812,137'Compliant sectioning facility for interactive sectioning of solid geometric objects using a graphics processor'1998

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1998–2021Patents assigned to IBM (47)· patent assignee history

1998–2021Based in Staatsburg, NY, US· patent location history

2015Patents assigned to CANFIELD SHAWN (1)· patent assignee history

2015Patents assigned to PEETS MICHAEL T (1)· patent assignee history

2015Patents assigned to WHITE WADE H (1)· patent assignee history

2018Patents assigned to INT BUSINESS CORPORATION CORPORATION (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
IBM	47	1998–2021
CANFIELD SHAWN	1	2015
INT BUSINESS CORPORATION CORPORATION	1	2018
PEETS MICHAEL Tself	1	2015
WHITE WADE H	1	2015

Locations

Location	Patents	Span
Staatsburg, New York, US	48	1998–2021