Inventor
Isaac Huang
Inventor
Tainan, TW
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices38%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1023%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
H10DInorganic electric semiconductor devices15%
PatentTitleYear
10,535,629Method of manufacturing semiconductor structure202010,163,849Method of manufacturing semiconductor structure20189,799,625'Semiconductor structure and manufacturing method thereof'20179,105,651'Method of fabricating a MOS device using a stress-generating material'20159,006,058'Method for fabricating semiconductor device'2015Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2015Patents assigned to UNITED MICROELECTRONICS CORP (2)· patent assignee history
2015–2020Based in Tainan, TW· patent location history
2017–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 3 | 2017–2020 |
| UNITED MICROELECTRONICS CORP | 2 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tainan, TW | 5 | 2015–2020 |