Inventor

Eric Beyne

Inventor

Leuven, BE

Overview

1997–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 60 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%

H01LSemiconductor devices13%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%

H05KPrinted circuits5%

H10DInorganic electric semiconductor devices4%

H01HElectric switches3%

H01JElectric discharge tubes or discharge lamps3%

B81BMicrostructural devices or systems, e.g. micromechanical devices3%

Y02PClimate change mitigation technologies in the production or processing of goods3%

B29LIndexing scheme associated with subclass b29c, relating to particular articles2%

PatentTitleYear

10,985,057Method for contacting a buried interconnect rail of an integrated circuit chip from the back side of the IC2021 10,886,252Method of bonding semiconductor substrates2021 10,797,016Method for bonding semiconductor chips to a landing wafer2020 10,636,739Integrated circuit chip with power delivery network on the backside of the chip2020 10,332,850Method for producing contact areas on a semiconductor substrate2019 10,334,755Liquid cooling of electronic devices2019 10,271,796Biocompatible packaging2019 10,256,183MIMCAP structure in a semiconductor device package2019 10,170,450Method for bonding and interconnecting integrated circuit devices2019 10,141,284Method of bonding semiconductor substrates2018 10,066,303Thin NiB or CoB capping layer for non-noble metallic bonding landing pads2018 9,978,710Method for self-aligned solder reflow bonding and devices obtained thereof2018 9,966,325Semiconductor die package and method of producing the package2018 9,960,080Method for bonding and interconnecting integrated circuit devices2018 9,799,632'Method for aligning micro-electronic components'2017 9,646,930'Semiconductor device having through-substrate vias'2017 9,601,459'Method for aligning micro-electronic components'2017 9,508,665'Method for insertion bonding and device thus obtained'2016 9,048,198'Biocompatible packaging'2015 8,907,471'Window interposed die packaging'2014 8,822,330'Method for providing oxide layers'2014 8,809,188'Method for fabricating through substrate vias'2014 8,742,590'Method for forming isolation trenches'2014 8,735,182'Method for detecting embedded voids in a semiconductor substrate'2014 8,647,920'Method for forming 3D-interconnect structures with airgaps'2014 8,536,047'Methods and systems for material bonding'2013 8,493,736'Device for cooling integrated circuits'2013 8,450,825'Semiconductor package'2013 8,440,504'Method for aligning and bonding elements and a device comprising aligned and bonded elements'2013 7,880,315'Methods for bonding and micro-electronic devices produced according to such methods'2011 7,835,157'System for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules'2010 7,795,113'Method for bonding a die or substrate to a carrier'2010 7,737,552'Device having a bonding structure for two elements'2010 7,687,904'Plurality of devices attached by solder bumps'2010 7,566,634'Method for chip singulation'2009 7,547,625'Methods for bonding and micro-electronic devices produced according to such methods'2009 7,378,297'Methods of bonding two semiconductor devices'2008 7,368,311'Method and system for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules'2008 7,205,177'Methods of bonding two semiconductor devices'2007 6,908,856'Method for producing electrical through hole interconnects and devices made thereof'2005 6,876,056'Method and system for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules'2005 6,812,078'Method for transferring and stacking of semiconductor devices'2004 6,730,997'Method of transferring ultra-thin substrates and application of the method to the manufacture of a multi-layered thin film device'2004 6,711,813'Method for fabricating a thin film build-up structure on a sequentially laminated printed circuit board base'2004 6,576,505'Method for transferring and stacking of semiconductor devices'2003 6,566,745'Image sensor ball grid array package and the fabrication thereof'2003 6,518,088'Polymer stud grid array'2003 6,506,664'Method of transferring ultra-thin substrates and application of the method to the manufacture of a multi-layer thin film device'2003 6,362,484'Imager or particle or radiation detector and method of manufacturing the same'2002 6,297,072'Method of fabrication of a microstructure having an internal cavity'2001 6,278,410'Wide frequency band planar antenna'2001 6,249,048'Polymer stud grid array'2001 6,130,478'Polymer stud grid array for microwave circuit arrangements'2000 6,121,622'Imager or particle detector and method of manufacturing the same'2000 6,122,172'Polymer stud grid array'2000 5,929,516'Polymer stud grid array'1999 5,927,853'Method for thermal impedance evaluation of packaged semiconductor components'1999 5,795,063'Method and apparatus for thermal impedance evaluation of packaged semiconductor components'1998 5,731,584'Position sensitive particle sensor and manufacturing method therefor'1998 5,675,295'Microwave oscillator, an antenna therefor and methods of manufacture'1997

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1997–2021Patents assigned to IMEC VZW (22)· patent assignee history

1997–2021Based in Heverlee, BE· patent location history

1998–2009Patents assigned to IMEC INTER UNI MICRO ELECTR (15)· patent assignee history

1999–2019Based in Leuven, BE· patent location history

2001–2020Patents assigned to UNIV LEUVEN KATH (7)· patent assignee history

2010–2019Patents assigned to IMEC (20)· patent assignee history

2013–2016Patents assigned to BEYNE ERIC (12)· patent assignee history

2014Based in Kapeldreef, BE· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
IMEC VZW	22	1997–2021
IMEC	20	2010–2019
IMEC INTER UNI MICRO ELECTR	15	1998–2009
BEYNE ERICself	12	2013–2016
UNIV LEUVEN KATH	7	2001–2020

Locations

Location	Patents	Span
Leuven, BE	43	1999–2019
Heverlee, BE	16	1997–2021
Kapeldreef, BE	1	2014