LexDanaLexDanabeta
Inventor

BRANDON JAY HOLYBEE

Inventor
US

Overview

3→
Patents
2024–2025
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices30%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1030%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds10%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices10%
PatentTitleYear
12,293,913Directed self-assembly enabled subtractive metal patterning202512,266,527Directed self-assembly enabled patterning over metal layers using assisting features202512,012,473Directed self-assembly structures and techniques2024

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2024–2025Patents assigned to INTEL CORP (3)· patent assignee history
2024–2025Based in US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
INTEL CORP32024–2025
Locations
LocationPatentsSpan
US32024–2025