Inventor
Seishi Oida
Inventor
Kyoto, JP
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1044%
H05KPrinted circuits25%
B29CShaping or joining of plastics13%
Y02PClimate change mitigation technologies in the production or processing of goods13%
H01LSemiconductor devices6%
PatentTitleYear
9,018,761'Semiconductor device'20158,283,759'Lead frame having outer leads coated with a four layer plating'20126,917,118'Semiconductor device'20056,853,077'Semiconductor device, semiconductor packaging method, assembly and method for fabricating the same'20056,291,274'Resin molded semiconductor device and method for manufacturing the same'20016,258,314'Method for manufacturing resin-molded semiconductor device'20016,126,885'Method for manufacturing resin-molded semiconductor device'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2001Patents assigned to MATSUSHITA ELECTRONICS CORP (2)· patent assignee history
2000–2015Based in Kyoto, JP· patent location history
2001–2005Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (3)· patent assignee history
2012–2015Patents assigned to OIDA SEISHI (2)· patent assignee history
2012–2015Patents assigned to PANASONIC CORP (2)· patent assignee history
2012Patents assigned to KADOSAKI KOUICHI (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MATSUSHITA ELECTRIC INDUSTRIAL CO LTD | 3 | 2001–2005 |
| MATSUSHITA ELECTRONICS CORP | 2 | 2000–2001 |
| OIDA SEISHIself | 2 | 2012–2015 |
| PANASONIC CORP | 2 | 2012–2015 |
| KADOSAKI KOUICHI | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kyoto, JP | 7 | 2000–2015 |