Inventor
Wei-Sheng Lei
Inventor
San Jose, CA, US
Overview
Patents· 85 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1028%
H01LSemiconductor devices25%
B23KSoldering or unsoldering17%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%
H10DInorganic electric semiconductor devices8%
H01JElectric discharge tubes or discharge lamps5%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form1%
Y10TTechnical subjects covered by former us classification1%
A47GHousehold or table equipment0%
B05BSpraying apparatus0%
PatentTitleYear
10,947,118Carbon nanotubes and preparation method thereof by using PET202110,714,390Wafer dicing using femtosecond-based laser and plasma etch202010,661,383Mitigation of particle contamination for wafer dicing processes202010,566,238Wafer dicing using femtosecond-based laser and plasma etch202010,535,561Hybrid wafer dicing approach using a multiple pass laser scribing process and plasma etch process202010,363,629Mitigation of particle contamination for wafer dicing processes201910,163,713Wafer dicing using femtosecond-based laser and plasma etch20189,972,575Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process20189,852,997Hybrid wafer dicing approach using a rotating beam laser scribing process and plasma etch process20179,768,014'Wafer coating'20179,721,839'Etch-resistant water soluble mask for hybrid wafer dicing using laser scribing and plasma etch'20179,620,379'Multi-layer mask including non-photodefinable laser energy absorbing layer for substrate dicing by laser and plasma etch'20179,601,375'UV-cure pre-treatment of carrier film for wafer dicing using hybrid laser scribing and plasma etch approach'20179,583,375'Water soluble mask formation by dry film lamination'20179,460,966'Method and apparatus for dicing wafers having thick passivation polymer layer'20169,443,765'Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing'20169,412,619'Method of outgassing a mask material deposited over a workpiece in a process tool'20169,355,907'Hybrid wafer dicing approach using a line shaped laser beam profile laser scribing process and plasma etch process'20169,349,648'Hybrid wafer dicing approach using a rectangular shaped two-dimensional top hat laser beam profile or a linear shaped one-dimensional top hat laser beam profile laser scribing process and plasma etch process'20169,343,366'Dicing wafers having solder bumps on wafer backside'20169,330,977'Hybrid wafer dicing approach using a galvo scanner and linear stage hybrid motion laser scribing process and plasma etch process'20169,312,177'Screen print mask for laser scribe and plasma etch wafer dicing process'20169,299,611'Method of wafer dicing using hybrid laser scribing and plasma etch approach with mask plasma treatment for improved mask etch resistance'20169,281,244'Hybrid wafer dicing approach using an adaptive optics-controlled laser scribing process and plasma etch process'20169,275,902'Dicing processes for thin wafers with bumps on wafer backside'20169,269,604'Wafer edge warp suppression for thin wafer supported by tape frame'20169,263,308'Water soluble mask for substrate dicing by laser and plasma etch'20169,252,057'Laser and plasma etch wafer dicing with partial pre-curing of UV release dicing tape for film frame wafer application'20169,245,803'Hybrid wafer dicing approach using a bessel beam shaper laser scribing process and plasma etch process'20169,245,802'Wafer dicing using femtosecond-based laser and plasma etch'20169,236,305'Wafer dicing with etch chamber shield ring for film frame wafer applications'20169,224,625'Laser and plasma etch wafer dicing using water-soluble die attach film'20159,224,650'Wafer dicing from wafer backside and front side'20159,218,992'Hybrid laser and plasma etch wafer dicing using substrate carrier'20159,209,084'Maskless hybrid laser scribing and plasma etching wafer dicing process'20159,196,536'Hybrid wafer dicing approach using a phase modulated laser beam profile laser scribing process and plasma etch process'20159,177,861'Hybrid wafer dicing approach using laser scribing process based on an elliptical laser beam profile or a spatio-temporal controlled laser beam profile'20159,177,864'Method of coating water soluble mask for laser scribing and plasma etch'20159,165,832'Method of die singulation using laser ablation and induction of internal defects with a laser'20159,159,621'Dicing tape protection for wafer dicing using laser scribe process'20159,159,624'Vacuum lamination of polymeric dry films for wafer dicing using hybrid laser scribing and plasma etch approach'20159,142,459'Wafer dicing using hybrid laser scribing and plasma etch approach with mask application by vacuum lamination'20159,130,057'Hybrid dicing process using a blade and laser'20159,130,030'Baking tool for improved wafer coating process'20159,130,056'Bi-layer wafer-level underfill mask for wafer dicing and approaches for performing wafer dicing'20159,126,285'Laser and plasma etch wafer dicing using physically-removable mask'20159,129,904'Wafer dicing using pulse train laser with multiple-pulse bursts and plasma etch'20159,112,050'Dicing tape thermal management by wafer frame support ring cooling during plasma dicing'20159,105,710'Wafer dicing method for improving die packaging quality'20159,093,518'Singulation of wafers having wafer-level underfill'20159,076,860'Residue removal from singulated die sidewall'20159,054,176'Multi-step and asymmetrically shaped laser beam scribing'20159,048,309'Uniform masking for wafer dicing using laser and plasma etch'20159,041,198'Maskless hybrid laser scribing and plasma etching wafer dicing process'20159,018,079'Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate reactive post mask-opening clean'20159,012,305'Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate non-reactive post mask-opening clean'20158,991,329'Wafer coating'20158,993,414'Laser scribing and plasma etch for high die break strength and clean sidewall'20158,980,727'Substrate patterning using hybrid laser scribing and plasma etching processing schemes'20158,980,726'Substrate dicing by laser ablation and plasma etch damage removal for ultra-thin wafers'20158,975,163'Laser-dominated laser scribing and plasma etch hybrid wafer dicing'20158,975,162'Wafer dicing from wafer backside'20158,969,177'Laser and plasma etch wafer dicing with a double sided UV-curable adhesive film'20158,951,819'Wafer dicing using hybrid split-beam laser scribing process with plasma etch'20158,946,057'Laser and plasma etch wafer dicing using UV-curable adhesive film'20158,940,619'Method of diced wafer transportation'20158,932,939'Water soluble mask formation by dry film lamination'20158,927,393'Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing'20158,912,077'Hybrid laser and plasma etch wafer dicing using substrate carrier'20148,912,078'Dicing wafers having solder bumps on wafer backside'20148,912,075'Wafer edge warp supression for thin wafer supported by tape frame'20148,883,614'Wafer dicing with wide kerf by laser scribing and plasma etching hybrid approach'20148,883,615'Approaches for cleaning a wafer during hybrid laser scribing and plasma etching wafer dicing processes'20148,859,397'Method of coating water soluble mask for laser scribing and plasma etch'20148,853,056'Wafer dicing using femtosecond-based laser and plasma etch'20148,846,498'Wafer dicing using hybrid multi-step laser scribing process with plasma etch'20148,845,854'Laser, plasma etch, and backside grind process for wafer dicing'20148,703,581'Water soluble mask for substrate dicing by laser and plasma etch'20148,652,940'Wafer dicing used hybrid multi-step laser scribing process with plasma etch'20148,642,448'Wafer dicing using femtosecond-based laser and plasma etch'20148,598,016'In-situ deposited mask layer for device singulation by laser scribing and plasma etch'20138,557,682'Multi-layer mask for substrate dicing by laser and plasma etch'20138,557,683'Multi-step and asymmetrically shaped laser beam scribing'20138,507,363'Laser and plasma etch wafer dicing using water-soluble die attach film'20138,129,658'Systems for thin film laser scribing devices'2012Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2012–2020Patents assigned to APPLIED MATERIALS INC (84)· patent assignee history
2012–2017Patents assigned to LEI WEI-SHENG (46)· patent assignee history
2012–2020Based in San Jose, CA, US· patent location history
2013–2017Patents assigned to EATON BRAD (44)· patent assignee history
2013–2017Patents assigned to KUMAR AJAY (44)· patent assignee history
2014–2017Patents assigned to PAPANU JAMES S (21)· patent assignee history
2015Based in Santa Clara, CA, US· patent location history
2021Based in Xi'an, CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 84 | 2012–2020 |
| LEI WEI-SHENGself | 46 | 2012–2017 |
| EATON BRAD | 44 | 2013–2017 |
| KUMAR AJAY | 44 | 2013–2017 |
| PAPANU JAMES S | 21 | 2014–2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| San Jose, California, US | 83 | 2012–2020 |
| Xi'an, CN | 1 | 2021 |
| Santa Clara, California, US | 1 | 2015 |