Inventor
Chin-Sheng Wang
Inventor
Hsinchu County, TW
Overview
Patents· 17 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
H05KPrinted circuits18%
H01LSemiconductor devices15%
Y10TTechnical subjects covered by former us classification8%
G06FElectric digital data processing5%
H04BTransmission5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form3%
B65DContainers for storage or transport of articles or materials, e.g. bags, barrels, bottles, boxes, cans, cartons, crates, drums, jars, tanks, hoppers, forwarding containers3%
C23CCoating metallic material3%
PatentTitleYear
10,714,448Chip module with porous bonding layer and stacked structure with porous bonding layer202010,515,870Package carrier having a mesh gas-permeable structure disposed in the through hole201910,319,610Package carrier201910,177,067Manufacturing method of package carrier20199,870,931'Package carrier and manufacturing method thereof'20189,591,753'Circuit board and manufacturing method thereof'20179,458,540'Package substrate and manufacturing method thereof'20169,433,099'Package carrier'20169,282,643'Core substrate and method for fabricating circuit board'20169,204,546'Circuit board and manufacturing method thereof'20159,008,736'Protective frame for mobile communication device'2015D0722952'Detachable smartphone protective device with backup power unit'20158,859,908'Package carrier'2014D0712385'Mobile phone protecting case'20148,634,887'Protective frame for mobile communication device'20148,563,363'Fabricating method of semiconductor package structure'20138,390,013'Semiconductor package structure and fabricating method of semiconductor package structure'2013Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2013–2019Patents assigned to SUBTRON TECHNOLOGY CO LTD (11)· patent assignee history
2013–2016Patents assigned to WANG CHIN-SHENG (8)· patent assignee history
2013–2020Based in Hsinchu, TW· patent location history
2014–2015Patents assigned to TAER INNOVATION CO LTD (3)· patent assignee history
2014–2019Based in Hsinchu County, TW· patent location history
2014–2015Based in Taipei, TW· patent location history
2015–2016Patents assigned to Wang chao-min (3)· patent assignee history
2015–2016Patents assigned to CHEN CHING-SHENG (2)· patent assignee history
2015Based in New Taipei, TW· patent location history
2019Based in Taoyuan, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SUBTRON TECHNOLOGY CO LTD | 11 | 2013–2019 |
| WANG CHIN-SHENGself | 8 | 2013–2016 |
| TAER INNOVATION CO LTD | 3 | 2014–2015 |
| Wang chao-min | 3 | 2015–2016 |
| CHEN CHING-SHENG | 2 | 2015–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu County, TW | 9 | 2014–2019 |
| Hsinchu, TW | 3 | 2013–2020 |
| Taipei, TW | 3 | 2014–2015 |
| Taoyuan, TW | 1 | 2019 |
| New Taipei, TW | 1 | 2015 |