Inventor
Zhichao Zhang
Inventor
Chandler, AZ, US
Overview
Patents· 54 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits16%
H01LSemiconductor devices11%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
H01RElectrically-conductive connections8%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein5%
H01PWaveguides5%
G06FElectric digital data processing4%
H10DInorganic electric semiconductor devices3%
Y02PClimate change mitigation technologies in the production or processing of goods3%
Y10TTechnical subjects covered by former us classification3%
PatentTitleYear
10,797,394Antenna modules and communication devices202010,784,428LED filament and LED light bulb202010,716,231Pin count socket having reduced pin count and pattern transformation202010,672,693Integrated circuit structures in package substrates202010,658,765Edge-firing antenna walls built into substrate202010,651,525Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubs202010,620,526Mask, manufacturing method thereof, patterning method employing mask, optical filter202010,617,000Printed circuit board (PCB) with three-dimensional interconnects to other printed circuit boards2020D0879958Medical balloon Group202010,580,806Method of manufacturing a display substrate, method of manufacturing a display device and display substrate202010,431,912CPU socket contact for improving bandwidth throughput201910,433,421Reduced capacitance land pad201910,416,378Chip-to-chip interconnect with embedded electro-optical bridge structures201910,317,932Capacitive structures for crosstalk reduction201910,307,728High reactivity lime hydrate and methods of manufacturing and uses thereof201910,303,225Methods of forming hybrid socket structures for package interconnect applications and structures formed thereby201910,241,361Color film substrate, manufacturing method thereof and display device201910,209,584Manufacturing method of metal layer, functional substrate and manufacturing method thereof, and display device201910,209,573UV curing mask plate and a fabricating method thereof and a display device201910,103,054Coupled vias for channel cross-talk reduction201810,088,518Apparatus and method for classifying and locating electrical faults in circuitry20189,992,859Low loss and low cross talk transmission lines using shaped vias20189,971,089Chip-to-chip interconnect with embedded electro-optical bridge structures20189,922,751'Helically insulated twinax cable systems and methods'20189,899,430'GOA unit and method for producing the same, gate driver circuit'20189,899,225'Method for manufacturing array substrate, array substrate and mask'20189,894,752'Inductors for circuit board through hole structures'20189,832,876CPU package substrates with removable memory mechanical interfaces20179,807,866'Shielding mold for electric and magnetic EMI mitigation'20179,806,011'Non-uniform substrate stackup'20179,775,224'Discharge apparatus and display panel preparation system based thereon'20179,761,617'Method for manufacturing array substrate, array substrate and display device'20179,721,979'Method for manufacturing array substrate, array substrate and display device'20179,710,089'Touch display panel having a plurality of spacers connected to a thin film transistor and manufacturing method thereof'20179,570,386'Flexible package-to-socket interposer'20179,564,407'Crosstalk polarity reversal and cancellation through substrate material'20179,548,734'Smart impedance matching for high-speed I/O'20179,517,471'High reactivity lime hydrate and methods of manufacturing and uses thereof'20169,491,881'Microelectronic socket comprising a substrate and an insulative insert mated with openings in the substrate'20169,478,881'Snap connector for socket assembly and associated techniques and configurations'20169,391,018'Crosstalk polarity reversal and cancellation through substrate material tuning'20169,385,457'Connector assembly and method'20169,232,639'Non-uniform substrate stackup'20169,076,698'Flexible package-to-socket interposer'20159,069,910'Mechanism for facilitating dynamic cancellation of signal crosstalk in differential input/output channels'20158,905,794'Connector assembly and method'20148,643,184'Crosstalk polarity reversal and cancellation through substrate material tuning'20148,614,333'Acenaphtho heterocyclic compound and application thereof'20138,508,947'Flex cable and method for making the same'20138,451,028'Methods and devices for detecting single-event transients'20138,394,901'Bi-component catalyst system for isoprene or butadiene cis 1, 4-polymerization and polymerization process'20138,025,531'Shielded socket housing'20117,889,148'Compact broad-band admittance tunnel incorporating gaussian beam antennas'20117,480,605'Techniques for determining parameter variability for interconnects in the presence of manufacturing uncertainty'2009Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2009–2011Based in Tempe, AZ, US· patent location history
2011–2020Patents assigned to INTEL CORP (34)· patent assignee history
2011–2020Based in Chandler, AZ, US· patent location history
2013–2017Patents assigned to ZHANG ZHICHAO (8)· patent assignee history
2013–2015Patents assigned to AYGUN KEMAL (3)· patent assignee history
2016–2019Based in Chesterfield, MO, US· patent location history
2017–2020Patents assigned to BEIJING BOE DISPLAY TECH CO (10)· patent assignee history
2017–2020Patents assigned to BOE TECHNOLOGY GROUP CO LTD (10)· patent assignee history
2017–2020Based in Beijing, CN· patent location history
2020Based in Zhejiang, CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 34 | 2011–2020 |
| BEIJING BOE DISPLAY TECH CO | 10 | 2017–2020 |
| BOE TECHNOLOGY GROUP CO LTD | 10 | 2017–2020 |
| ZHANG ZHICHAOself | 8 | 2013–2017 |
| AYGUN KEMAL | 3 | 2013–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Chandler, AZ, US | 34 | 2011–2020 |
| Beijing, CN | 11 | 2017–2020 |
| Chesterfield, MO, US | 2 | 2016–2019 |
| Tempe, AZ, US | 2 | 2009–2011 |
| Zhejiang, CN | 1 | 2020 |