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Inventor

YU-HAO CHIEN

Inventor
TW

Overview

3→
Patents
2021–2022
Patent span
Performing operations
Primary field (CPC B)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B81Bprimary
B81BMicrostructural devices or systems, e.g. micromechanical devices43%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems29%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure29%
PatentTitleYear
11,518,673MEMS device and method for manufacturing the same202211,312,624MEMS device and manufacturing method thereof202211,137,296Force sensor with MEMS-based device and force touching member2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2022Patents assigned to MIRAMEMS SENSING TECH CO LTD (3)· patent assignee history
2021–2022Based in TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MIRAMEMS SENSING TECH CO LTD32021–2022
Locations
LocationPatentsSpan
TW32021–2022