Inventor
RAVINDRANATH MAHAJAN
Inventor
US
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1035%
H01LSemiconductor devices32%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
H05KPrinted circuits5%
H03KPulse technique3%
H10DInorganic electric semiconductor devices3%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact2%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application2%
G02BOptical elements, systems or apparatus2%
H01FMagnets2%
PatentTitleYear
12,469,801Moisture seal coating of hybrid bonded stacked die package assembly202512,366,713Heat dissipation structures for optical communication devices202512,272,656Heterogeneous nested interposer package for IC chips202512,243,806Nested architectures for enhanced heterogeneous integration202512,238,892Immersion cooling for integrated circuit devices202512,224,103Angled inductor with small form factor202512,206,410Programmable logic device with fine-grained disaggregation202512,199,048Heterogeneous nested interposer package for IC chips202512,183,649IC package including multi-chip unit with bonded integrated heat spreader202412,142,545Nested architectures for enhanced heterogeneous integration202412,074,102Structural elements for application specific electronic device packages202412,048,123Heat dissipation device having shielding/containment extensions202411,824,018Heterogeneous nested interposer package for IC chips202311,804,418Direct liquid micro jet (DLMJ) structures for addressing thermal performance at limited flow rate conditions202311,798,865Nested architectures for enhanced heterogeneous integration202311,756,856Package architecture including thermoelectric cooler structures202311,749,577IC package including multi-chip unit with bonded integrated heat spreader202311,742,261Nested architectures for enhanced heterogeneous integration202311,735,533Heterogeneous nested interposer package for IC chips202311,595,045Programmable logic device with fine-grained disaggregation202311,581,235IC package including multi-chip unit with bonded integrated heat spreader202311,545,407Thermal management solutions for integrated circuit packages2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2025Patents assigned to INTEL CORP (22)· patent assignee history
2023–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 22 | 2023–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 22 | 2023–2025 |