LexDanaLexDanabeta
Inventor

Mingzhu Wang

Inventor
Ningbo, CN

Overview

70→
Patents
2001–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 70 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H04Nprimary
H04NPictorial communication, e.g. television19%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation14%
G02BOptical elements, systems or apparatus13%
H05KPrinted circuits11%
H01LSemiconductor devices8%
B29CShaping or joining of plastics6%
B29LIndexing scheme associated with subclass b29c, relating to particular articles6%
G03BApparatus or arrangements for taking photographs or for projecting or viewing them4%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h103%
B29DProducing particular articles from plastics or from substances in a plastic state3%
PatentTitleYear
10,827,103Fixed-focus camera module and manufacturing method therefor202010,804,305Manufacture of semiconductor module with dual molding202010,782,593Lens module and capturing module intergrating focusing mechanism and assembly method therefor202010,778,897Method for compensating for image quality of optical system by means of lens adjustment202010,771,666Image capturing module and electrical support thereof202010,768,391Adjustable optical lens and camera module and aligning method thereof202010,750,074Camera module and electrical holder and assembling method thereof202010,750,071Camera module with lens array arrangement, circuit board assembly, and image sensor and manufacturing method thereof202010,742,859Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof202010,735,637Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof202010,732,376Camera lens module and manufacturing method thereof202010,735,631Electrical bracket and circuit conducting method for camera module202010,708,480Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof202010,701,255Photographing module and electric bracket thereof202010,678,016Camera lens module with one or more optical lens modules and manufacturing method thereof202010,670,946Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device202010,666,847Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof202010,659,664Camera module and molded circuit board assembly and manufacturing method thereof202010,630,876Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device202010,578,837Molded photosensitive assembly for array imaging module for electronic device202010,582,097Photosensitive assembly and camera module and manufacturing method thereof202010,498,942Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof201910,477,088Camera module and array camera module based on integral packaging technology201910,461,116Semiconductor packaging method and semiconductor device based on molding process201910,440,247Camera module and manufacturing method thereof201910,432,9273D test chart, adjusting arrangement, forming method and adjusting method thereof201910,412,278System-level camera module with electrical support and manufacturing method thereof201910,367,983Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof201910,353,167Camera lens module with one or more optical lens modules and manufacturing method thereof201910,356,299Camera module and electric holder and assembling method thereof201910,321,028Photosensitive assembly and camera module and manufacturing method thereof201910,302,892Camera lens module and manufacturing method thereof201910,281,674Adjustable optical lens and camera module and manufacturing method thereof201910,274,694Manufacturing method of a molded photosensitive assembly of an array imaging module201910,277,792Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof201910,237,460Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof201910,228,532Camera lens module and manufacturing method thereof201910,230,879Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof201910,230,876System-level camera module with encapsulated electrical support201910,222,573Adjustable optical lens and camera module and manufacturing method thereof201910,212,322Camera module and electric holder and assembling method thereof201910,197,890Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device201910,194,064Array camera module based on integral packaging technology201910,192,914Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof201910,175,447Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device201910,171,716Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof201910,148,859Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device201810,136,041Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof201810,129,452Camera module and array camera module based on integral packaging technology201810,126,519Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device201810,129,451Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof201810,116,843Electrical bracket and circuit conducting method for camera module201810,110,791Camera module and array camera module based on integral packaging technology201810,084,949Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof201810,051,167Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof201810,033,913Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device20189,998,644Camera module and molded circuit board assembly and manufacturing method thereof20189,992,397Camera module and molded circuit board assembly and manufacturing method thereof20189,955,055Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device20189,906,700'Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device'20189,900,487'Camera module and array camera module based on integral packaging technology'20189,894,772'Manufacturing method of molded photosensitive assembly for electronic device'20189,876,949Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof20189,876,948Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof20189,848,109Camera module and array camera module based on integral packaging technology20179,826,132'Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device'20179,781,324'Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device'20179,781,325'Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device'20179,781,323'Camera module and manufacturing method thereof'20176,182,575'Adjustable stop-wagon retarders with locking function for wagons at high speed and disposal methods thereof'2001

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2001Patents assigned to CHINA TDJ SYSTEM RES CT (1)· patent assignee history
2001Based in Harbin, CN· patent location history
2017–2020Patents assigned to NINGBO SUNNY OPOTECH CO LTD (68)· patent assignee history
2017–2020Based in Ningbo, CN· patent location history
2018Patents assigned to NINGHO SUNNY OPOTECH CO LTD (1)· patent assignee history
2019–2020Patents assigned to NINGBO SUNNY OPTOTECH CO LTD (2)· patent assignee history
2020Patents assigned to SUNNY OPOTECH NORTH AMERICA INC (1)· patent assignee history
2020Based in Zhejiang, CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
NINGBO SUNNY OPOTECH CO LTD682017–2020
NINGBO SUNNY OPTOTECH CO LTD22019–2020
CHINA TDJ SYSTEM RES CT12001
NINGHO SUNNY OPOTECH CO LTD12018
SUNNY OPOTECH NORTH AMERICA INC12020
Locations
LocationPatentsSpan
Ningbo, CN662017–2020
Zhejiang, CN32020
Harbin, CN12001