Inventor

Chia-Tien Wu

Inventor

Taichung, TW

Overview

43→

Patents

1997–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 43 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary

H01LSemiconductor devices28%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1028%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%

H10DInorganic electric semiconductor devices11%

H01MProcesses or means, e.g. batteries, for the direct conversion of chemical energy into electrical energy2%

Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution2%

B23PMetal-working not otherwise provided for1%

B82YSpecific uses or applications of nanostructures1%

E05FDevices for moving wings into open or closed position1%

E06BFixed or movable closures for openings in buildings, vehicles, fences or like enclosures in general, e.g. doors, windows, blinds, gates1%

PatentTitleYear

10,879,120Self aligned via and method for fabricating the same2020 10,847,460Advanced metal connection with metal cut2020 10,847,418Formation method of damascene structure2020 10,818,509Method of fabricating semiconductor device with reduced trench distortions2020 10,784,155Multi-metal fill with self-align patterning2020 10,784,151Interconnect structure and manufacturing method for the same2020 10,777,452Interconnection structure having top and bottom vias with a barrier layer therebetween and a dielectric spacer at the bottom via2020 10,734,275Metal routing with flexible space formed using self-aligned spacer patterning2020 10,535,560Interconnection structure of semiconductor device2020 10,529,617Metal routing with flexible space formed using self-aligned spacer patterning2020 10,522,469Split rail structures located in adjacent metal layers2019 10,483,159Multi-metal fill with self-align patterning2019 10,475,703Structure and formation method of damascene structure2019 10,468,349Advanced metal connection with metal cut2019 10,276,396Method for forming semiconductor device with damascene structure2019 10,269,715Split rail structures located in adjacent metal layers2019 10,163,6902-D interconnections for integrated circuits2018 10,163,654Method of fabricating semiconductor device with reduced trench distortions2018 10,162,930Method of adjusting metal line pitch2018 10,109,582Advanced metal connection with metal cut2018 10,103,102Structure and formation method of semiconductor device structure2018 10,026,647Multi-metal fill with self-align patterning2018 10,020,261Split rail structures located in adjacent metal layers2018 9,997,404Method of forming an interconnect structure for a semiconductor device2018 9,865,539'Structure and formation method of semiconductor device structure'2018 9,721,836'Structure and formation method of damascene structure'2017 9,716,035'Combination interconnect structure and methods of forming same'2017 9,595,471'Conductive element structure and method'2017 9,583,383'Air gap forming techniques based on anodic alumina for interconnect structures'2017 9,490,136'Method of forming trench cut'2016 9,431,297'Method of forming an interconnect structure for a semiconductor device'2016 9,425,089'Conductive element structure and method'2016 9,418,868'Method of fabricating semiconductor device with reduced trench distortions'2016 9,412,649'Method of fabricating semiconductor device'2016 9,412,652'Air gap forming techniques based on anodic alumina for interconnect structures'2016 9,397,045'Structure and formation method of damascene structure'2016 9,305,837'Semiconductor arrangement and formation thereof'2016 9,076,790'Air gap forming techniques based on anodic alumina for interconnect structures'2015 7,867,641'Solar energy power supply system'2011 7,585,586'Battery'2009 6,826,834'Manufacturing method of a muffler assembly'2004 6,530,415'Force reducing device and method for adjusting shutter ropes'2003 5,676,222'Device for generating a rotary return force'1997

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1997–2020Based in Taichung, TW· patent location history

2009–2011Patents assigned to WU CHIA-TIEN (2)· patent assignee history

2009–2011Patents assigned to WU CHIA-YUN (2)· patent assignee history

2009–2011Patents assigned to WU I-LONG (2)· patent assignee history

2015–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (37)· patent assignee history

2016–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	37	2015–2020
TAIWAN SEMICONDUCTOR MFG	2	2016–2020
WU CHIA-TIENself	2	2009–2011
WU CHIA-YUN	2	2009–2011
WU I-LONG	2	2009–2011

Locations

Location	Patents	Span
Taichung, TW	43	1997–2020