Inventor

Ryo Fukasawa

Inventor

Nagano, JP

Overview

25→

Patents

2006–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 25 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1016%

H01LSemiconductor devices15%

A63FCard, board, or roulette games10%

H05KPrinted circuits8%

G01RMeasuring electric variables7%

G06FElectric digital data processing7%

Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution5%

H02JElectric power networks3%

H04BTransmission3%

H04NPictorial communication, e.g. television3%

PatentTitleYear

10,644,515Information processing system, information processing device, operation device, and power supply method2020 10,516,280Information processing system, information processing device, operation device, and power supply method2019 10,183,633Vehicle-mounted-camera bracket2019 10,187,979Wiring substrate and electronic component device2019 10,143,917Operation system, game system, and game controller capable of identifying connected device with simplified scheme2018 9,960,120Wiring substrate with buried substrate having linear conductors2018 9,799,596'Wiring substrate and semiconductor device'2017 9,721,876'Semiconductor device and method of making the same'2017 9,630,099'Information processing device, information processing system, and launch program and storage medium storing the same providing photographing functionality'2017 9,530,725'Wiring substrate and semiconductor package'2016 9,488,677'Probe card having a wiring substrate'2016 9,476,913'Probe card'2016 9,470,718'Probe card'2016 9,459,289'Probe card and method for manufacturing probe card'2016 9,373,587'Stacked electronic device'2016 9,204,544'Wiring substrate and method of manufacturing the same'2015 9,202,781'Wiring substrate, method for manufacturing wiring substrate, and semiconductor package'2015 9,040,832'Wiring substrate and method of manufacturing the same'2015 8,917,985'Imaging apparatus'2014 8,848,100'Information processing device, information processing system, and launch program and storage medium storing the same providing photographing functionality'2014 8,053,877'Semiconductor package'2011 7,977,569'Dye sensitized solar cell module and manufacturing method thereof'2011 7,648,906'Method and apparatus for processing a conductive thin film'2010 7,169,501'Fuel cell'2007 7,030,420'Swing-type display device'2006

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2006–2020Patents assigned to NINTENDO CO LTD (7)· patent assignee history

2006–2020Based in Kyoto, JP· patent location history

2007–2019Patents assigned to SHINKO ELECTRIC IND CO (16)· patent assignee history

2007–2019Based in Nagano, JP· patent location history

2011–2019Based in Kanagawa, JP· patent location history

2014–2015Patents assigned to FUKASAWA RYO (3)· patent assignee history

2014Patents assigned to EHARA YUI (2)· patent assignee history

2014Patents assigned to KOSHIISHI KAZUNORI (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
SHINKO ELECTRIC IND CO	16	2007–2019
NINTENDO CO LTD	7	2006–2020
FUKASAWA RYOself	3	2014–2015
EHARA YUI	2	2014
KOSHIISHI KAZUNORI	2	2014

Locations

Location	Patents	Span
Nagano, JP	16	2007–2019
Kyoto, JP	7	2006–2020
Kanagawa, JP	2	2011–2019