Inventor
Justin Ho Kuen WONG
Inventor
US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1036%
B24BMachines, devices, or processes for grinding or polishing29%
H01LSemiconductor devices21%
B08BCleaning in general7%
F26BDrying solid materials or objects by removing liquid therefrom7%
PatentTitleYear
12,142,513Wafer processing tools and methods thereof202412,030,156Polishing carrier head with piezoelectric pressure control202411,929,264Drying system with integrated substrate alignment stage202411,890,715Polishing carrier head with piezoelectric pressure control202411,749,552Wafer processing tools and methods thereof2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2024Patents assigned to APPLIED MATERIALS INC (5)· patent assignee history
2023–2024Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 5 | 2023–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 5 | 2023–2024 |