Inventor
Robert S. Lewandowski
Inventor
Amsterdam, NY, US
Overview
Patents· 23 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B06Bprimary
B06BMethods or apparatus for generating or transmitting mechanical vibrations of infrasonic, sonic, or ultrasonic frequency, e.g. for performing mechanical work in general20%
Y10TTechnical subjects covered by former us classification13%
A61BDiagnosis12%
G10KSound-producing devices12%
H10NElectric solid-state devices not otherwise provided for7%
G01SRadio direction-finding5%
G01HMeasurement of mechanical vibrations or ultrasonic, sonic or infrasonic waves3%
G01TMeasurement of nuclear or x-radiation3%
H01RElectrically-conductive connections3%
H05KPrinted circuits3%
PatentTitleYear
8,659,148'Tileable sensor array'20148,475,375'System and method for actively cooling an ultrasound probe'20138,207,652'Ultrasound transducer with improved acoustic performance'20128,176,787'Systems and methods for operating a two-dimensional transducer array'20127,791,252'Ultrasound probe assembly and method of fabrication'20107,622,848'Transducer assembly with z-axis interconnect'20097,441,321'Method of manufacturing ultrasound transducer device having acoustic backing'20087,285,897'Curved micromachined ultrasonic transducer arrays and related methods of manufacture'20077,229,292'Interconnect structure for transducer assembly'20077,156,938'Method for making multi-layer ceramic acoustic transducer'20077,148,608'Multi-layer ceramic acoustic transducer'20067,053,530'Method for making electrical connection to ultrasonic transducer through acoustic backing material'20067,017,245'Method for making multi-layer ceramic acoustic transducer'20066,974,333'High-density connection between multiple circuit boards'20056,831,394'Backing material for micromachined ultrasonic transducer devices'20046,541,896'Method for manufacturing combined acoustic backing and interconnect module for ultrasonic array'20035,951,304'Fanout interconnection pad arrays'19995,834,880'Multilayer array ultrasonic transducers'19985,704,105'Method of manufacturing multilayer array ultrasonic transducers'19985,467,779'Multiplanar probe for ultrasonic imaging'19954,522,849'Method for coating quartz with boron nitride'19854,313,257'Annealing methods for improving performance of a radiation sensor'19824,245,157'Electron irradiation method for improving performance of a radiation sensor'1981Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1981–2014Patents assigned to GEN ELECTRIC (23)· patent assignee history
1981–2014Based in Amsterdam, NY, US· patent location history
2012–2014Patents assigned to BAUMGARTNER CHARLES EDWARD (3)· patent assignee history
2012–2014Patents assigned to LEWANDOWSKI ROBERT STEPHEN (3)· patent assignee history
2012–2013Patents assigned to HAIDER BRUNO HANS (2)· patent assignee history
2013–2014Patents assigned to SMITH LOWELL SCOTT (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| GEN ELECTRIC | 23 | 1981–2014 |
| BAUMGARTNER CHARLES EDWARD | 3 | 2012–2014 |
| LEWANDOWSKI ROBERT STEPHENself | 3 | 2012–2014 |
| HAIDER BRUNO HANS | 2 | 2012–2013 |
| SMITH LOWELL SCOTT | 2 | 2013–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Amsterdam, New York, US | 23 | 1981–2014 |