Inventor
Hiroyuki Esashi
Inventor
Kanagawa, JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B23Kprimary
B23KSoldering or unsoldering13%
B29CShaping or joining of plastics13%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering13%
G05BControl or regulating systems in general13%
G06FElectric digital data processing13%
F01KSteam engine plants6%
F02CGas-turbine plants6%
F02GHot gas or combustion-product positive-displacement engine plants6%
H04LTransmission of digital information, e.g. telegraphic communication6%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution6%
PatentTitleYear
10,471,651Repair system, repair-data providing apparatus and repair-data generation method201910,382,250Information processing system and control method for information processing system201910,138,758Quatro-generation system201810,065,375Additive manufacturing system, modeling-data providing apparatus and providing method2018Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2018–2019Patents assigned to MITSUBISHI HITACHI POWER SYS (2)· patent assignee history
2018Patents assigned to MITSUBISHI HEAVY IND LTD (1)· patent assignee history
2018–2019Based in Kanagawa, JP· patent location history
2018–2019Based in Tokyo, JP· patent location history
2019Patents assigned to FUJITSU ADVANCED ENG LTD (1)· patent assignee history
2019Patents assigned to FUJITSU LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MITSUBISHI HITACHI POWER SYS | 2 | 2018–2019 |
| FUJITSU ADVANCED ENG LTD | 1 | 2019 |
| FUJITSU LTD | 1 | 2019 |
| MITSUBISHI HEAVY IND LTD | 1 | 2018 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kanagawa, JP | 2 | 2018–2019 |
| Tokyo, JP | 2 | 2018–2019 |