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Inventor

Shou-Hsien Weng

Inventor
New Taipei, TW

Overview

2→
Patents
2010–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices20%
H03FAmplifiers20%
H03HImpedance networks, e.g. resonant circuits20%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
PatentTitleYear
11,004,733Protection structures for bonded wafers20217,728,673'Wideband active balun using darlington pair'2010

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2010Patents assigned to UNIV NAT CENTRAL (1)· patent assignee history
2010Based in Taoyuan County, TW· patent location history
2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (1)· patent assignee history
2021Based in New Taipei, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD12021
UNIV NAT CENTRAL12010
Locations
LocationPatentsSpan
New Taipei, TW12021
Taoyuan County, TW12010