Inventor

Kurt R. Grebe

Inventor

Beacon, NY, US

Overview

1982–2002

Patent span

Electricity

Primary field (CPC H)

Patents· 20 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%

H05KPrinted circuits21%

Y10TTechnical subjects covered by former us classification17%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%

B23KSoldering or unsoldering4%

C23CCoating metallic material4%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%

B41JTypewriters2%

C23GCleaning or de-greasing of metallic material by chemical methods other than electrolysis2%

F28FDetails of heat-exchange and heat-transfer apparatus, of general application2%

PatentTitleYear

6,403,892'Coated means for connecting a chip and a card'2002 5,546,655'Method of applying flex tape protective coating onto a flex product'1996 5,462,628'Method for bonding two surfaces together'1995 5,373,627'Method of forming multi-chip module with high density interconnections'1994 5,360,946'Flex tape protective coating'1994 5,305,340'Waveguide ridge laser device with improved mounting and ridge protection'1994 5,274,913'Method of fabricating a reworkable module'1994 5,242,713'Method for conditioning an organic polymeric material'1993 5,074,969'Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate'1991 5,042,709'Methods and apparatus for precise alignment of objects'1991 5,038,195'Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate'1991 5,022,462'Flexible finned heat exchanger'1991 4,970,868'Apparatus for temperature control of electronic devices'1990 4,964,458'Flexible finned heat exchanger'1990 4,832,255'Precision solder transfer method and means'1989 4,759,403'Hydraulic manifold for water cooling of multi-chip electric modules'1988 4,730,666'Flexible finned heat exchanger'1988 4,725,850'Electromagnetic head with separate addressability resolution and imaging resolution functions'1988 4,379,218'Fluxless ion beam soldering process'1983 4,316,200'Contact technique for electrical circuitry'1982

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1982–2002Patents assigned to IBM (19)· patent assignee history

1982–2002Based in Beacon, NY, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
IBM	19	1982–2002

Locations

Location	Patents	Span
Beacon, New York, US	20	1982–2002