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Inventor

Kaoru Shibata

Inventor
Itami, JP

Overview

15→
Patents
1978–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 15 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices10%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation10%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
Y02PClimate change mitigation technologies in the production or processing of goods7%
B23KSoldering or unsoldering5%
Y10TTechnical subjects covered by former us classification5%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form3%
C08JWorking-up3%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light3%
PatentTitleYear
10,547,324Data compression coding method, apparatus therefor, and program therefor202010,024,516Optical module20189,887,310'Semiconductor layered structure, method for producing semiconductor layered structure, and method for producing semiconductor device'20189,773,932'Epitaxial wafer and method for manufacturing same'20179,698,287'Epitaxial wafer, method for producing the same, semiconductor element, and optical sensor device'20179,680,040'Semiconductor device and method for manufacturing the same'20179,171,978'Epitaxial wafer, method for producing the same, photodiode, and optical sensor device'20159,156,626'Work method and work device'20159,123,843'Semiconductor device'20158,560,573'Map difference data generation apparatus and map difference data generation method'20138,302,479'Method of evaluation using ultrasonic waves'20127,640,809'Spot welding inspecting apparatus'20107,110,859'Setting method and setting apparatus for operation path for articulated robot'20066,858,288'Wrap film'20054,117,193'Antistatic, low temperature heat sealable polypropylene composite film and process for production thereof'1978

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2006–2015Patents assigned to HONDA MOTOR CO LTD (4)· patent assignee history
2006–2012Based in Utsunomiya, JP· patent location history
2010–2015Based in Tochigi, JP· patent location history
2012–2013Patents assigned to SHIBATA KAORU (2)· patent assignee history
2013–2020Patents assigned to DENSO CORP (2)· patent assignee history
2013–2020Patents assigned to KOUSOKUYA INC (2)· patent assignee history
2013Based in Kawasaki, JP· patent location history
2015–2018Patents assigned to SUMITOMO ELECTRIC INDUSTRIES (7)· patent assignee history
2015–2018Based in Itami, JP· patent location history
2020Based in Kanagawa, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SUMITOMO ELECTRIC INDUSTRIES72015–2018
HONDA MOTOR CO LTD42006–2015
DENSO CORP22013–2020
KOUSOKUYA INC22013–2020
SHIBATA KAORUself22012–2013
Locations
LocationPatentsSpan
Itami, JP72015–2018
Tochigi, JP22010–2015
Utsunomiya, JP22006–2012
Kanagawa, JP12020
Kawasaki, JP12013