Inventor

Chin-Chang Cheng

Inventor

Portland, OR, US

Overview

27→

Patents

1994–2011

Patent span

Electricity

Primary field (CPC H)

Patents· 27 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1019%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1016%

Y10TTechnical subjects covered by former us classification14%

C23CCoating metallic material13%

B60BVehicle wheels6%

B62BHand-propelled vehicles, e.g. hand carts or perambulators6%

H05KPrinted circuits5%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%

B82YSpecific uses or applications of nanostructures3%

A47CChairs2%

PatentTitleYear

7,964,174'Nanotube growth and device formation'2011 7,694,413'Method of making a bottomless via'2010 7,663,230'Methods of forming channels on an integrated circuit die and die cooling systems including such channels'2010 7,629,252'Conformal electroless deposition of barrier layer materials'2009 7,597,763'Electroless plating systems and methods'2009 7,470,617'Treating a liner layer to reduce surface oxides'2008 7,358,201'Methods of forming channels on an integrated circuit die and die cooling systems including such channels'2008 7,285,494'Multiple stage electroless deposition of a metal layer'2007 7,262,504'Multiple stage electroless deposition of a metal layer'2007 7,223,694'Method for improving selectivity of electroless metal deposition'2007 7,087,104'Preparation of electroless deposition solutions'2006 7,049,234'Multiple stage electroless deposition of a metal layer'2006 7,008,872'Use of conductive electrolessly deposited etch stop layers, liner layers and via plugs in interconnect structures'2006 6,958,547'Interconnect structures containing conductive electrolessly deposited etch stop layers, liner layers, and via plugs'2005 6,919,231'Methods of forming channels on an integrated circuit die and die cooling systems including such channels'2005 6,843,852'Apparatus and method for electroless spray deposition'2005 6,733,679'Method of treating an electroless plating waste'2004 5,669,466'Front wheel for a handcart'1997 5,624,199'Setting device for a joint'1997 5,595,092'Positioning device of retractable bars of a trolley'1997 5,586,775'Foldable apparatus of a baggage cart'1996 5,584,529'Folding chair'1996 5,505,471'Trolley with retractable wheels'1996 5,494,340'Wheel-mounting assembly for a handcart'1996 5,494,341'Wheel shaft mounting assembly for a handcart'1996 5,490,688'Control device for folding and expanding a baggage cart'1996 5,314,241'Handcart wheel-mounting apparatus'1994

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1994Patents assigned to CHENG CHIN CHANG (1)· patent assignee history

1994–1997Based in Chung-Ho City, Taipei Hsien, TW· patent location history

2004–2011Patents assigned to INTEL CORP (17)· patent assignee history

2004–2006Based in Hillsboro, OR, US· patent location history

2005–2011Based in Portland, OR, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
INTEL CORP	17	2004–2011
CHENG CHIN CHANGself	1	1994

Locations

Location	Patents	Span
Portland, OR, US	13	2005–2011
Chung-Ho City, Taipei Hsien, TW	10	1994–1997
Hillsboro, OR, US	4	2004–2006