Inventor
Rao V. Vallabhaneni
Inventor
Wappingers Falls, NY, US
Overview
Patents· 27 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits19%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
Y10TTechnical subjects covered by former us classification15%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests12%
C04BLime, magnesia6%
B22FWorking metallic powder4%
C22CAlloys4%
H01BCables3%
H01JElectric discharge tubes or discharge lamps3%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form2%
PatentTitleYear
6,974,358'Discrete magnets in dielectric forming metal/ceramic laminate and process thereof'20056,955,777'Method of forming a plate for dispensing chemicals'20056,653,776'Discrete magnets in dielectric forming metal/ceramic laminate and process thereof'20036,494,758'Process of forming metal/ferrite laminated magnet'20026,376,054'Surface metallization structure for multiple chip test and burn-in'20026,358,439'Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias'20026,319,829'Enhanced interconnection to ceramic substrates'20016,312,791'Multilayer ceramic substrate with anchored pad'20016,291,272'Structure and process for making substrate packages for high frequency application'20016,238,741'Single mask screening process'20016,199,747'High temperature refractory joining paste'20016,187,418'Multilayer ceramic substrate with anchored pad'20016,124,041'Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias'20006,117,367'Pastes for improved substrate dimensional control'20006,096,565'Multi-layer glass ceramic module with superconductor wiring'20006,002,951'Multi-layer ceramic substrate having high TC superconductor circuitry'19995,925,443'Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias'19995,787,578'Method of selectively depositing a metallic layer on a ceramic substrate'19985,763,093'Aluminum nitride body having graded metallurgy'19985,682,589'Aluminum nitride body having graded metallurgy'19975,552,232'Aluminum nitride body having graded metallurgy'19965,552,107'Aluminum nitride body having graded metallurgy'19965,525,761'Copper-based paste containing refractory metal additions for densification control'19965,512,711'Copper-based paste containing refractory metal additions for densification control'19965,337,475'Process for producing ceramic circuit structures having conductive vias'19945,283,104'Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates'19945,073,180'Method for forming sealed co-fired glass ceramic structures'1991Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1991–2005Patents assigned to IBM (27)· patent assignee history
1991–2002Based in Wappingers Falls, NY, US· patent location history
1996–1998Patents assigned to CARBORUNDUM CO (3)· patent assignee history
2000–2005Based in Hopewell Junction, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 27 | 1991–2005 |
| CARBORUNDUM CO | 3 | 1996–1998 |
Locations
| Location | Patents | Span |
|---|---|---|
| Wappingers Falls, New York, US | 16 | 1991–2002 |
| Hopewell Junction, New York, US | 11 | 2000–2005 |