Inventor
Hideki Higashitani
Inventor
Kyoto, JP
Overview
16→
Patents
2001–2011
Patent span
General tagging of new technological developments
Primary field (CPC Y)
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits35%
Y10TTechnical subjects covered by former us classification30%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests22%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
PatentTitleYear
8,071,881'Wiring board, method for manufacturing same and semiconductor device'20117,968,803'Wiring substrate, wiring material, copper-clad laminate, and method of manufacturing the wiring substrate'20117,291,915'Circuit board and method of manufacturing the same'20077,252,891'Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same'20077,247,508'Semiconductor device with intermediate connector'20077,200,927'Method for producing a wiring transfer sheet'20077,132,029'Multilayer circuit board and method for manufacturing the same'20067,018,705'Multilayer circuit board and method for manufacturing the same'20066,946,205'Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same'20056,926,789'Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same'20056,748,652'Circuit board and method of manufacturing the same'20046,745,464'Removable film, a substrate with film, a process for forming the removable film and a process for the manufacturing of the circuit board'20046,565,954'Circuit board and method of manufacturing the same'20036,546,624'Removable film, a substrate with film, a process for forming the removable film and a process for the manufacturing of the circuit board'20036,532,651'Circuit board and method of manufacturing the same'20036,197,407'Circuit board and method of manufacturing the same'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2007Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (14)· patent assignee history
2001–2011Based in Osaka, JP· patent location history
2003–2011Based in Kyoto, JP· patent location history
2004–2006Based in Nishikamo-gun, JP· patent location history
2005–2007Based in Kizu-cho, JP· patent location history
2011Patents assigned to PANASONIC CORP (2)· patent assignee history
2011Patents assigned to HIGASHITANI HIDEKI (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MATSUSHITA ELECTRIC INDUSTRIAL CO LTD | 14 | 2001–2007 |
| PANASONIC CORP | 2 | 2011 |
| HIGASHITANI HIDEKIself | 1 | 2011 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kyoto, JP | 6 | 2003–2011 |
| Kizu-cho, JP | 4 | 2005–2007 |
| Osaka, JP | 3 | 2001–2011 |
| Nishikamo-gun, JP | 3 | 2004–2006 |