Inventor
Bang-Chiang Lan
Inventor
Taipei, TW
Overview
Patents· 27 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B81Cprimary
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems25%
B81BMicrostructural devices or systems, e.g. micromechanical devices16%
H10DInorganic electric semiconductor devices13%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers9%
Y10TTechnical subjects covered by former us classification9%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
G02BOptical elements, systems or apparatus4%
H01LSemiconductor devices4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%
PatentTitleYear
9,988,264Method of fabricating integrated structure for MEMS device and semiconductor device20189,783,408'Structure of MEMS electroacoustic transducer'20179,150,407'Method for fabricating MEMS device with protection rings'20158,872,287'Integrated structure for MEMS device and semiconductor device and method of fabricating the same'20148,865,500'Method of fabricating a MEMS microphone with trenches serving as vent pattern'20148,798,291'Structure of MEMS electroacoustic transducer and fabricating method thereof'20148,710,601'MEMS structure and method for making the same'20148,642,986'Integrated circuit having microelectromechanical system device and method of fabricating the same'20148,587,078'Integrated circuit and fabricating method thereof'20138,558,336'Semiconductor photodetector structure and the fabrication method thereof'20138,525,389'MEMS device with protection rings'20138,502,382'MEMS and protection structure thereof'20138,460,960'Method for fabricating integrated circuit'20138,384,214'Semiconductor structure, pad structure and protection structure'20138,368,153'Wafer level package of MEMS microphone and manufacturing method thereof'20138,310,065'Semiconductor device and wafer structure'20128,299,555'Semiconductor optoelectronic structure'20128,207,523'Metal oxide semiconductor field effect transistor with strained source/drain extension layer'20128,208,768'Focusing member and optoelectronic device'20128,193,640'MEMS and a protection structure thereof'20128,139,907'Optoelectronic device and method of forming the same'20128,096,048'Method for fabricating MEMS structure'20128,058,133'Method of fabrication of metal oxide semiconductor field effect transistor'20117,935,590'Method of manufacturing metal oxide semiconductor and complementary metal oxide semiconductor'20117,898,081'MEMS device and method of making the same'20117,851,975'MEMS structure with metal protection rings'20107,135,365'Method of manufacturing MOS transistors'2006Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2006–2018Patents assigned to UNITED MICROELECTRONICS CORP (27)· patent assignee history
2006–2018Based in Taipei, TW· patent location history
2011–2014Patents assigned to LAN BANG-CHIANG (20)· patent assignee history
2012–2014Patents assigned to HUANG CHIEN-HSIN (18)· patent assignee history
2012–2014Patents assigned to WU HUI-MIN (16)· patent assignee history
2012–2014Patents assigned to SU TZUNG-I (15)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| UNITED MICROELECTRONICS CORP | 27 | 2006–2018 |
| LAN BANG-CHIANGself | 20 | 2011–2014 |
| HUANG CHIEN-HSIN | 18 | 2012–2014 |
| WU HUI-MIN | 16 | 2012–2014 |
| SU TZUNG-I | 15 | 2012–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Taipei, TW | 27 | 2006–2018 |