Inventor
Brad Smith
Inventor
Gieres, FR
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%
H10DInorganic electric semiconductor devices10%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
B24BMachines, devices, or processes for grinding or polishing5%
G01RMeasuring electric variables5%
G03BApparatus or arrangements for taking photographs or for projecting or viewing them5%
G03GElectrography5%
G06QInformation and communication technology [ict] specially adapted for administrative, commercial, financial, managerial or supervisory purposes5%
G11CStatic stores5%
H01BCables5%
PatentTitleYear
10,716,213Direct connection of high speed signals on PCB chip20208,251,776'Method and apparatus for conditioning a CMP pad'20127,994,069'Semiconductor wafer with low-K dielectric layer and process for fabrication thereof'20117,991,281'Illumination source having programmable rise and fall times'20117,956,400'MIM capacitor integration'20116,219,656'Memory integrity for meters'20015,960,270'Method for forming an MOS transistor having a metallic gate electrode that is formed after the formation of self-aligned source and drain regions'1999D0319768'Cordless hot air gun'1991Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1999Patents assigned to MOTOROLA INC (1)· patent assignee history
1999Based in Austin, TX, US· patent location history
2001Based in Seneca, SC, US· patent location history
2011–2012Patents assigned to FREESCALE SEMICONDUCTOR INC (3)· patent assignee history
2011Patents assigned to HEWLETT PACKARD DEVELOPMENT CO (1)· patent assignee history
2011–2012Based in Gieres, FR· patent location history
2011Based in Boise, ID, US· patent location history
2020Patents assigned to CRAY INC (1)· patent assignee history
2020Patents assigned to HEWLETT PACKARD ENTPR DEV LP (1)· patent assignee history
2020Based in Chippewa Falls, WI, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FREESCALE SEMICONDUCTOR INC | 3 | 2011–2012 |
| CRAY INC | 1 | 2020 |
| HEWLETT PACKARD DEVELOPMENT CO | 1 | 2011 |
| HEWLETT PACKARD ENTPR DEV LP | 1 | 2020 |
| MOTOROLA INC | 1 | 1999 |
Locations
| Location | Patents | Span |
|---|---|---|
| Gieres, FR | 3 | 2011–2012 |
| Chippewa Falls, WI, US | 1 | 2020 |
| Boise, ID, US | 1 | 2011 |
| Seneca, SC, US | 1 | 2001 |
| Austin, Texas, US | 1 | 1999 |