Inventor
RICHARD TE GAN
Inventor
US
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices37%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1037%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
H01QAntennas, i.e. radio aerials5%
PatentTitleYear
12,125,716Semiconductor device packaging warpage control202411,967,507Tie bar removal for semiconductor device packaging202411,791,283Semiconductor device packaging warpage control202311,728,285Semiconductor device packaging warpage control202311,705,410Semiconductor device having integrated antenna and method therefor202311,404,288Semiconductor device packaging warpage control202211,222,790Tie bar removal for semiconductor device packaging2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to NXP USA INC (7)· patent assignee history
2022–2024Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NXP USA INC | 7 | 2022–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 7 | 2022–2024 |