Inventor

Vijay D. Parkhe

Inventor
San Jose, CA, US

Overview

104→
Patents
1994–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 104 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
H01LSemiconductor devices18%
H01JElectric discharge tubes or discharge lamps9%
Y10TTechnical subjects covered by former us classification8%
C23CCoating metallic material7%
H02NElectric machines not otherwise provided for5%
B23QDetails, components, or accessories for machine tools, e.g. arrangements for copying or controlling3%
H05BElectric heating2%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein2%
B08BCleaning in general2%
PatentTitleYear
11,127,619Workpiece carrier for high power with enhanced edge sealing202111,088,005Electrostatic chuck having thermally isolated zones with minimal crosstalk202111,043,360Gas distribution plate assembly for high power plasma etch processes202110,973,088Optically heated substrate support assembly with removable optical fibers202110,957,572Multi-zone gasket for substrate support assembly202110,904,996Substrate support with electrically floating power supply202110,903,094Electrostatic puck assembly with metal bonded backing plate for high temperature processes202110,872,800Electrostatic chuck assembly for high temperature processes2020D0904640Substrate carrier202010,790,180Electrostatic chuck with variable pixelated magnetic field202010,770,270High power electrostatic chuck with aperture-reducing plug in a gas hole202010,736,182Apparatus, systems, and methods for temperature control of substrates using embedded fiber optics and epoxy optical diffusers202010,688,750Bonding structure of E chuck to aluminum base configuration202010,685,861Direct optical heating of substrates through optical guide202010,679,885Substrate support assembly with deposited surface features202010,622,229Electrostatic chuck with independent zone cooling and reduced crosstalk202010,582,570Sensor system for multi-zone electrostatic chuck202010,557,202Method of processing a substrate support assembly202010,541,171Protective cover for electrostatic chuck202010,535,544Tunable temperature controlled substrate support assembly202010,497,605Substrate carrier201910,460,916Real time monitoring with closed loop chucking force control201910,460,968Electrostatic chuck with variable pixelated magnetic field201910,403,534Pixilated cooling, temperature controlled substrate support assembly201910,395,964Apparatus and method for measurement of the thermal performance of an electrostatic wafer chuck201910,304,715Electrostatic chuck having thermally isolated zones with minimal crosstalk201910,249,526Substrate support assembly for high temperature processes201910,177,023Protective cover for electrostatic chuck201910,121,688Electrostatic chuck with external flow adjustments for improved temperature distribution201810,079,165Electrostatic chuck with independent zone cooling and reduced crosstalk201810,056,284Electrostatic chuck optimized for refurbishment201810,053,778Cooling pedestal with coating of diamond-like carbon201810,020,218Substrate support assembly with deposited surface features201810,008,404Electrostatic chuck assembly for high temperature processes201810,008,399Electrostatic puck assembly with metal bonded backing plate for high temperature processes20189,991,148Electrostatic chuck having thermally isolated zones with minimal crosstalk20189,986,598Temperature control apparatus including groove-routed optical fiber heating, substrate temperature control systems, electronic device processing systems, and processing methods20189,984,911Electrostatic chuck design for high temperature RF applications20189,969,022Vacuum process chamber component and methods of making20189,887,121'Protective cover for electrostatic chuck'20189,875,923Control systems employing deflection sensors to control clamping forces applied by electrostatic chucks, and related methods20189,865,489'Substrate support chuck cooling for deposition chamber'20189,853,579Rotatable heated electrostatic chuck20179,831,111Apparatus and method for measurement of the thermal performance of an electrostatic wafer chuck20179,805,965'Pixelated capacitance controlled ESC'20179,753,463'Increasing the gas efficiency for an electrostatic chuck'20179,698,041'Substrate temperature control apparatus including optical fiber heating, substrate temperature control systems, electronic device processing systems, and methods'20179,685,356'Substrate support assembly having metal bonded protective layer'20179,669,653'Electrostatic chuck refurbishment'20179,666,466'Electrostatic chuck having thermally isolated zones with minimal crosstalk'20179,666,467'Detachable high-temperature electrostatic chuck assembly'20179,668,373'Substrate support chuck cooling for deposition chamber'20179,622,375'Electrostatic chuck with external flow adjustments for improved temperature distribution'20179,608,549'Electrostatic chuck'20179,580,806'Method of processing a substrate support assembly'20179,558,981'Control systems employing deflection sensors to control clamping forces applied by electrostatic chucks, and related methods'20179,536,769'Pixelated capacitance controlled ESC'20179,520,315'Electrostatic chuck with internal flow adjustments for improved temperature distribution'20169,472,435'Tunable temperature controlled substrate support assembly'20169,472,410'Pixelated capacitance controlled ESC'20169,404,176'Substrate support with radio frequency (RF) return path'20169,196,514'Electrostatic chuck with variable pixilated heating'20158,971,009'Electrostatic chuck with temperature control'20158,852,348'Heat exchange pedestal with coating of diamond-like material'20148,559,159'Electrostatic chuck and methods of use thereof'20138,435,379'Substrate cleaning chamber and cleaning and conditioning methods'20138,390,980'Electrostatic chuck assembly'20138,320,099'Electrostatic chuck electrical balancing circuit repair'20128,114,477'Cleaning of a substrate support'20128,064,185'Electrostatic chuck electrical balancing circuit repair'20117,824,498'Coating for reducing contamination of substrates during processing'20107,655,316'Cleaning of a substrate support'20107,589,950'Detachable electrostatic chuck having sealing assembly'20096,853,533'Full area temperature controlled electrostatic chuck and method of fabricating same'20056,743,473'Chemical vapor deposition of barriers from novel precursors'20046,547,934'Reduction of metal oxide in a dual frequency etch chamber'20036,535,372'Controlled resistivity boron nitride electrostatic chuck apparatus for retaining a semiconductor wafer and method of fabricating the same'20036,503,368'Substrate support having bonded sections and method'20036,475,902'Chemical vapor deposition of niobium barriers for copper metallization'20026,395,157'Method and apparatus for sputter etch conditioning a ceramic body'20026,246,567'Apparatus for igniting a plasma in a plasma processing chamber'20016,224,035'Staple removing device'20016,217,655'Stand-off pad for supporting a wafer on a substrate support chuck'20016,190,037'Non-intrusive, on-the-fly (OTF) temperature measurement and monitoring system'20016,125,789'Increasing the sensitivity of an in-situ particle monitor'20006,117,246'Conductive polymer pad for supporting a workpiece upon a workpiece support surface of an electrostatic chuck'20006,057,244'Method for improved sputter etch processing'20006,033,482'Method for igniting a plasma in a plasma processing chamber'20005,908,334'Electrical connector for power transmission in an electrostatic chuck'19995,909,355'Ceramic electrostatic chuck and method of fabricating same'19995,903,428'Hybrid Johnsen-Rahbek electrostatic chuck having highly resistive mesas separating the chuck from a wafer supported thereupon and method of fabricating same'19995,886,865'Method and apparatus for predicting failure of an eletrostatic chuck'19995,861,086'Method and apparatus for sputter etch conditioning a ceramic body'19995,796,074'Wafer heater assembly'19985,757,537'Electrochromic devices and methods'19985,748,435'Apparatus for controlling backside gas pressure beneath a semiconductor wafer'19985,724,177'Electrochromic devices and methods'19985,699,192'Electrochromic structures and methods'19975,691,876'High temperature polyimide electrostatic chuck'19975,659,417'Electrochromic structures and methods'19975,650,052'Variable cell size collimator'19975,404,244'Electrochromic structures and methods'19955,370,775'Formation of chemically reduced electrode layers'19945,321,544'Electrochromic structures and methods'1994

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1994–1998Patents assigned to SUN ACTIVE GLASS ELECTROCHROM (7)· patent assignee history
1994–1998Based in Edison, NJ, US· patent location history
1997–2021Patents assigned to APPLIED MATERIALS INC (94)· patent assignee history
1997–2003Based in Sunnyvale, CA, US· patent location history
2002–2021Based in San Jose, CA, US· patent location history
2011–2018Patents assigned to PARKHE VIJAY D (11)· patent assignee history
2015–2017Patents assigned to BOYD JR WENDELL (3)· patent assignee history
2016–2017Patents assigned to BUSCHE MATTHEW J (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
APPLIED MATERIALS INC941997–2021
PARKHE VIJAY Dself112011–2018
SUN ACTIVE GLASS ELECTROCHROM71994–1998
BOYD JR WENDELL32015–2017
BUSCHE MATTHEW J22016–2017
Locations
LocationPatentsSpan
San Jose, California, US772002–2021
Sunnyvale, California, US201997–2003
Edison, New Jersey, US71994–1998