Inventor
Sadahiro Kishii
Inventor
Kawasaki, JP
Overview
Patents· 17 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Dprimary
H10DInorganic electric semiconductor devices16%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1016%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1016%
C09GPolishing compositions13%
C09KMaterials for miscellaneous applications, not provided for elsewhere13%
B24BMachines, devices, or processes for grinding or polishing8%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
B28DWorking stone or stone-like materials3%
C03CChemical composition of glasses, glazes or vitreous enamels3%
C23FNon-mechanical removal of metallic material from surface3%
PatentTitleYear
8,791,561'Semiconductor device and its manufacture method'20148,702,826'Abrasive agent, method for producing abrasive agents, and electronic device'20148,399,295'Semiconductor device and its manufacture method'20138,067,791'Semiconductor device and method for fabricating the same'20117,951,686'Method of manufacturing semiconductor device having device characteristics improved by straining surface of active region'20117,701,016'Semiconductor device having device characteristics improved by straining surface of active region and its manufacture method'20107,642,577'Semiconductor device and method for fabricating the same'20107,637,270'Method of washing a polished object'20097,501,686'Semiconductor device and method for manufacturing the same'20097,064,038'Semiconductor device and method for fabricating the same'20066,159,858'Slurry containing manganese oxide and a fabrication process of a semiconductor device using such a slurry'20006,114,247'Polishing cloth for use in a CMP process and a surface treatment thereof'20005,877,089'Slurry containing manganese oxide'19995,763,325'Fabrication process of a semiconductor device using a slurry containing manganese oxide'19985,624,300'Apparatus and method for uniformly polishing a wafer'19975,562,529'Apparatus and method for uniformly polishing a wafer'19965,227,339'Method of manufacturing semiconductor substrate and method of manufacturing semiconductor device composed of the substrate'1993Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1993–2014Patents assigned to FUJITSU LTD (14)· patent assignee history
1993–2014Based in Isehara, JP· patent location history
1996–2014Based in Kawasaki, JP· patent location history
2009–2010Patents assigned to FUJITSU MICROELECTRONICS LTD (2)· patent assignee history
2011–2013Patents assigned to KISHII SADAHIRO (2)· patent assignee history
2011Patents assigned to FUJITSU SEMICONDUCTOR LTD (1)· patent assignee history
2013–2014Patents assigned to SHINKO ELECTRIC IND CO (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FUJITSU LTD | 14 | 1993–2014 |
| FUJITSU MICROELECTRONICS LTD | 2 | 2009–2010 |
| KISHII SADAHIROself | 2 | 2011–2013 |
| SHINKO ELECTRIC IND CO | 2 | 2013–2014 |
| FUJITSU SEMICONDUCTOR LTD | 1 | 2011 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kawasaki, JP | 15 | 1996–2014 |
| Isehara, JP | 2 | 1993–2014 |