Inventor
ROGER ST. AMAND
Inventor
US
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1033%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
PatentTitleYear
12,159,823Semiconductor package with front side and back side redistribution structures and fabricating method thereof202412,051,611Carrier assisted substrate method of manufacturing an electronic device and electronic device produced thereby202411,652,038Semiconductor package with front side and back side redistribution structures and fabricating method thereof2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2024Patents assigned to AMKOR TECH SINGAPORE HOLDING PTE LTD (3)· patent assignee history
2023–2024Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AMKOR TECH SINGAPORE HOLDING PTE LTD | 3 | 2023–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 3 | 2023–2024 |